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무연 솔더가 적용된 자동차 전장부품 접합부의 열적.기계적 신뢰성 평가
하상수,김종웅,채종혁,문원철,홍태환,유충식,문정훈,정승부,Ha, Sang-Su,Kim, Jong-Woong,Chae, Jong-Hyuck,Moon, Won-Chul,Hong, Tae-Hwan,Yoo, Choong-Sik,Moon, Jeong-Hoon,Jung, Seung-Boo 대한용접접합학회 2006 대한용접·접합학회지 Vol.24 No.6
This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.
플립칩 솔더 접합부의 열,기계적 신뢰성 평가(1); 1. 유연솔더
김종웅 ( Jong Woong Kim ),김대곤 ( Dae Gon Kim ),하상수 ( Sang Su Ha ),문원철 ( Won Chul Moon ),유충식 ( Choong Sik Yoo ),문정훈 ( Jeong Hoon Moon ),정승부 ( Seung Boo Jung ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 대한금속·재료학회지 Vol.44 No.8
The microstructural investigation and thermo-mechanical reliability evaluation of the conventional Sn-37Pb solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of the chip side was Cu6Sn5 IMC layer, while a layer of Ni3Sn4 was formed between the solder and electroless Ni-P layer of the package side. The primary failure mechanism of the solder joints in this type of test method and package was confirmed to be thermally activated solder fatigue failure. The brittle interfacial failure mode was sometimes detected from the cross-sectional studies, but nearly whole of the failed packages showed the occurrence of the typical fatigue cracks.