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Sn-58Bi Solder와 OSP 표면 처리된 PCB의 접합강도에 미치는 시효처리와 에폭시의 영향
김정수,명우람,정승부,Kim, Jungsoo,Myung, Woo-Ram,Jung, Seung-Boo 한국마이크로전자및패키징학회 2014 마이크로전자 및 패키징학회지 Vol.21 No.4
Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time. 다양한 무연솔더합금 가운데 Sn-58Bi solder는 저융점이며 상대적으로 높은 인장강도를 갖고 있지만 취성적이라는 단점을 갖고 있다. 이러한 Sn-58Bi 솔더의 기계적 강도를 보완하기 위해 epoxy를 함유한 Sn-58Bi 솔더가 연구되어져왔다. 본 연구는 Sn-58Bi 솔더와 Sn-58Bi 에폭시 복합솔더를 이용하여 PCB 기판에 접합한 후, 시효처리에 따른 솔더/기판 계면 미세구조와 기계적 특성변화를 연구하였다. OSP 표면처리된 PCB 기판에 솔더볼을 형성 한 후 85, 95, 105, $115^{\circ}C$에서 100~1000 시간동안 시효처리하였으며, 기계적 특성평가로 저속전단시험을 진행하였다. 시효 처리 시간 및 온도의 증가에 따라 Cu6Sn5 금속간화합물층은 성장하였으며 Sn-58Bi 솔더 금속간화합물층이 Sn-58Bi 에폭시 복합솔더보다 두꺼웠다. 전단시험 결과, Sn-58Bi 에폭시 복합솔더가 Sn-58Bi 솔더보다 약 2배 높은 전단강도 값을 나타냈으며 시효시간이 증가할수록 전단강도 값은 감소하였다.
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SAC305 솔더, Sn58%Bi 솔더 및 에폭시 Sn58%Bi 솔더와 OSP표면처리된 PCB기판 접합부의 미세조직 및 낙하충격시험 평가
김경열(Kyung-Yeol Kim),정학산(Haksan Jeong),명우람(Woo-Ram Myung),정승부(Seung-Boo Jung) 대한용접·접합학회 2018 대한용접·접합학회지 Vol.36 No.2
Lead free Sn3.0%Ag0.5%Cu (SAC305) solder and low temperature Sn58%Bi solder have been widely used to replace lead based solder alloys. Because Sn58%Bi solder has poor ductility and shock absorbance ability, previous researches have tried to improve its mechanical properties by adding additional elements, reinforcements, carbon nano tube (CNT) and polymer. The bonding strength and drop impact reliability of SAC305 solder, Sn58%Bi and epoxy contained Sn58%Bi solder (epoxy Sn58%Bi solder) assembled on the OSP surface finished PCB substrate were investigated using low speed shear and board drop impact tests. After soldering, Cu6Sn5 intermetallic compound (IMC) was formed in the solders and OSP surface finished PCB substrate joints. Bonding strength and drop reliability of epoxy Sn58%Bi solder had superior mechanical properties than those of SAC305 solder and Sn58%Bi solder. The crack in the solder joint of SAC305 after board drop impact testing takes place within the IMC layer. However, the crack at the solder joint of the Sn58%Bi after board drop impact testing occurred on the interface between IMC layer and Sn58%Bi solder and the crack in the solder joint of the epoxy Sn58%Bi presented within the solder, respectively.
ScienceON
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