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New High Entropy Alloy (HEA) Reinforced SAC 305 Solder
Sri Harini Rajendran(라젠드란 스리 하리니),Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
In order to meet the demands for the developing packaging technologies and to be in pace with the WEEE (2012-19-EU) and RoHS (2002-95-EU) implementations, series of lead-free solders has been developed. Sn-3.0Ag-0.5Cu and Sn-58Bi are the interesting solders fulfilling the demands and environmental standards of consumer electronic industries. However, the brittle phases remain a serious threat in terms of mechanical reliability. Many methods have been adopted by the researches to enhance the reliability of existing solders such as micro-alloying and the addition of second phase particles. However, the quest for new solders remains among the researchers. In the present work, new high entropy alloys have been incorporated in the soldering field. Varying compositions of high entropy solder reinforced SAC alloys were prepared by mechanical mixing. The solder paste was printed and reflowed with 1608 chip capacitor. The microstructure and intermetallic phase evolution along the solder/capacitor for the high entropy solder addition has been characterized by scanning electron microscope. The optimum composition with good solderability were analyzed using wetting and spreading test (JIS-Z-319). The shear tests were analyzed for the mechanical reliability and the data is interpreted using Weibull statistical distribution. High entropy solders added have optimistic microstructure and solderability. Besides, high entropy solders are found to be beneficial in their mechanical properties.
ZnO Nano-particle-reinforced Sn58Bi Low Temperature Solder for Flexible Display Application
Jang Baeg Kim(김장백),Sri Harini Rajendran(라젠드란 스리 하리니),Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
With the WEEE (2012-19-EU) and RoHS (2002-95-EU) implementation, series of lead-free solders has been developed to meet the demands for various temperature ranges. Sn-58Bi solder is an interesting low-temperature candidate which meets the environmental standards of consumer electronics with good structural and mechanical reliability. However, presence of coarse Bi phase remains a serious concern in terms of mechanical reliability. Many methods have been adopted by the researches to enhance the reliability of Sn-Bi solders such as micro-alloying and the addition of second phase nanoparticles. Whereas nanoparticles are found to enhance the mechanical properties to a greater extent. The Sn58Bi low temperature solder can be applied to flexible display application. In the present work, ZrO2 nanoparticles were used as an additive in Sn-58Bi solder. The microstructure and spreading of Sn58Bi nanocomposite solder have been characterized by Scanning electron microscope and spreading test. Addition of ZnO nanoparticles is found to reduce the Sn-Bi interphase spacing and enhanced the spreading kinetics of Sn58Bi solder. Also, nanoparticles enhanced the tensile strength of Sn58Bi solder by dispersion strengthening. Ductility of Sn58Bi solder is enhanced for lower ZnO additions with dominant bulge fracture. However, at higher additions fracture surface is dominated by cleavage fracture.
Nanocomposite SAC Solders for Improving Reliability of Soldering Technology
Young Kyu Hong(홍영규),Sri Harini Rajendran(라젠드란 스리 하리니),Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
Nanocomposite Sn-Ag-Cu solders are the potential candidates in the advanced integrated circuit packaging such as flip-chip, and ball grid arrays. Sn-Ag-Cu solders are eco-friendly with desirable thermal and mechanical characteristics. In recent nanotechnology era, addition of nanoparticles in the solder matrix is explored widely as the nanoparticles to have a positive contribution in the Ag3Sn refinement, interfacial Cu6Sn5 suppression and the reliability of the solder joints. However, the contribution of nanoparticles in aging characteristics is still under investigation. In the present work, the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles are investigated. Nanocomposite pastes are fabricated by mechanically mixing ZrO2 and the solder paste. Addition of ZrO2 nanoparticles decreased theβ-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The solder joints were isothermally aged at 175˚C for 24, 48, 144 and 256 hours. ZrO2 addition decreased the diffusion coefficient from 1.74 x 10 -16 m/s to 3.83 x 10 -17 m/s, thereby reducing the growth of Cu-Sn IMC at the interface. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix.
Seong Min Seo(서성민),Sri Harini Rajendran(라젠드란 스리 하리니),Hye Jun Kang(강혜준),Jae Pil Jung(정재필) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.5
In recent years, growing demand in electronic industry for highly reliable products emphasize number of components involving metal ceramic combination. Wide range of ceramics like Al2O3, AlN, SiC are used as substrate materials for high power electronics to ensure reliable operations in aerospace, automotive and military industry as well in consumer electronics. Several bonding methods like partial transient liquid-phase bonding, diffusion bonding, brazing and glass adhesive bonding have been developed for ceramic-metal joining out of which active metal brazing is the most versatile bonding method adopted by the engineering industries. Ag-Cu-Sn-Ti fillers have received much attention in recent years due to their low bonding temperature and excellent wetting with ceramics. Due to the developments in engineering, recently multicomponent fillers are emerging. The Al2O3-Cu joint is applicable to an electric vehicle parts. This study was designed to investigate the active metal brazing of Al2O3 ceramic to copper brazed, using the multicomponent Ag-Cu-Sn-Zr-Ti filler alloy. Numerous fine and hexagonal-shaped rod-like ternary intermetallic (Zr, Ti)5Sn3 phase were found dispersed in the Ag-Cu matrix of Ag-18Cu-6Sn-3Zr-1Ti alloy. An approximate 15° reduction in contact angle and 3.1 °C reduction in melting point are observed upon the incorporation of Ti and Sn in Ag-18Cu-3Zr filler. Interestingly, the interface microstructure of Al2O3/Cu joints brazed by using Ag-18Cu-6Sn-3Zr-1Ti filler shows a double reaction layer: a discontinuous Ti-rich layer consisting of (Cu, Al)3(Ti, Zr)3O, TiO, and in-situ Cu-(Ti, Zr) precipitates on the Al2O3 side and continuous Zr-rich layer consisting of ZrO2 on the filler side. The shear strength achieved in Al2O3/Cu joints brazed with Ag-18Cu-6Sn-3Zr-1Ti filler is 31% higher, compared to the joints brazed with Ag-18Cu-6Sn-3Zr filler. Failure analysis reveals a composite fracture mode indicating a strong interface bonding in Al2O3/Ag-18Cu-6Sn-3Zr-1Ti filler/Cu joints. The findings will be helpful towards the development of high entropy brazing fillers in the future.
김장백,서성민,강혜준,조도훈,스리 하리니 라젠드란,정재필,Kim, Jang Baeg,Seo, Seong Min,Kang, Hye Jun,Cho, Do Hoon,Rajendran, Sri Harini,Jung, Jae Pil 한국마이크로전자및패키징학회 2021 마이크로전자 및 패키징학회지 Vol.28 No.1
Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.
Flexible Electronics용 Sn-58Bi 저온 솔더 특성에 미치는 W 나노 입자의 영향
이재연(Jaeyeon Yi),김장백(Jang Beak Kim),라젠드란 스리 하리니(Sri Harini Rajendran),정재필(Jae Pil Jung) 대한용접·접합학회 2021 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.2021 No.11
마이크로/나노 전자 소자의 고성능화, 융/복합화, 미세화가 급격하기 진행됨에 따라 칩과 기기를 하나의 시스템으로 구성하기 위한 패키징 기술은 그 중요성이 더욱 커지고 있다. 칩의 성능을 효과적으로 활용하기 위하여 다양한 패키징 기술이 개발되었고, 그 중에서 특히 칩과 기판 사이를 직접 적합하는 역할을 하는 솔더의 전기적/환경적 요구를 개선하기 위한 많은 연구가 진행되었다. 특히, Sn-58Bi는 가장 대표적으로 사용되는 저온 무연 솔더 소재는 flexible electronics나 wearable electronics 에 적용되고 있지만, 취성이 있어서 휨 변형이나 장기적인 신뢰성이 떨어진다는 단점을 가지고 있다. 본 연구에서는 기존 Sn-58Bi에 W 나노 입자를 첨가하여 금속학적, 기계적 특성을 개선하고자 하였다. 본 연구에서는 Sn-58Bi에 W 나노 입자의 첨가에 따른 젖음성, 퍼짐성, 미세조직, 인장강도, 연성 등의 물성 변화를 분석, 측정하였다. 실험 결과, Sn-58Bi의 microstructure가 미세화되는 경향을 확인하였고, 최적 나노 W 함량에서 Sn-58Bi에 비해, 인장강도 및 연성이 개선되었다. 이를 통해, W 나노 입자의 최적 첨가 결과에 확보에 따라, felxible electronics용 차세대 솔더로서의 적용 가능성을 확인하였다.