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Sintered Metal Wicks Development for the High Performance Loop Heat Pipe(LHP) Systems
최지훈(Jeehoon Choi),성병호(Byungho Sung),유정현(Junghyun Yoo),서민환(Minwhan Seo),김철주(Chulju Kim) 대한기계학회 2007 대한기계학회 춘추학술대회 Vol.2007 No.5
The Loop Heat Pipe(LHP) system uses capillary forces so as to pump the working fluid from heat acquisition to heat rejecting systems. The performance of the LHP systems depends mainly upon the operating performance of the wick structure. The capillary pressure increases with decreasing the pore size of the wick structure. By the way, the wick structure's permeability decreases with decreasing the pore size and the porosity. To obtain an ideal wick, the wick structure should possess several characteristics such as the small pore size, high porosity and chemical compatibility with working fluid. Sintered metal wicks have been mainly used as the capillary wick structure mounted in LHP because of the fact that the sintered metal wick has some advantages like convenient selection of wick material, smaller pore size and so on as well as high reliability. In this study, sintered metal wicks were developed to meet required several parameters to design the high performance LHP systems for obtaining even more effective cooling technologies.
데스크탑 PC용 CPU 냉각 시스템 최적화를 위한 수치해석 연구
최지훈(Jeehoon Choi),유정현(Junghyun Yoo),서민환(Minwhan Seo),강신재(Shinjae Kang),김철주(Chulju Kim) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
The increasing demands for the recently released CPU which has had higher heat density, the confined space of desktop PCs, and so on are the main drive for continuously improving PC cooling systems. In order to meet number of demands, this paper describes the flow and thermal behavior of the heat sink combined with heat pipes, and a fan through the numerical analysis by using the computational fluid dynamics(CFD) code and discusses how to extend the cooling capability.
최지훈(Jeehoon Choi),유정현(Junghyun Yoo),서민환(Minwhan Seo),강신재(Shinjae Kang),김철주(Chulju Kim) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
The high performance CPUs have been developed to satisfy the extensive data and graphic processing requirements. At the same time, the necessity of thermal management for the CPUs is also becoming significant. The active cooling technology as a heat sink to combine with a fan and heat pipes has been widely used in the desktop PC markets. However, the increased heat dissipation and higher heat density is even required to optimize that cooling technology under the limitation of overall volume, weigh, and acoustic noise. For the optimal design, this paper discusses the flow and thermal behavior in the cooling equipment for desktop PC CPUs by using CFO code how to extend the air cooling capability and maximize its performance
Xuan Hung Nguyen,Byung-ho Sung(성병호),Jeehoon Choi(최지훈),Junghyung Yoo(유정현),Minwhan Seo(서민환),Chulju Kim(김철주) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.
원판형 LHP 증발부의 소결 금속 윅에서의 접촉 저항에 관한 연구
조정래(Jungrae Jo),최지훈(Jeehoon Choi),성병호(Byung-ho Sung),기재형(Jaehyung Ki),유성열(Seongryoul Ryoo),김철주(Chulju Kim) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.11
LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.