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BT40용 A.T.C Test Bench 개발에 관한 연구
김재현(J.H. Kim),이춘만(C.M. Lee),이문재(M.J. Lee),김광선(K.S. Kim),최준영(J.Y. Choi) 한국생산제조학회 2010 한국생산제조시스템학회 학술발표대회 논문집 Vol.2010 No.10
This paper is on the development of A.T.C Test Bench for BT40. A Test Bench is consist of hardware part, electronic device part and software part. It is designed to test vibration status and degree of precise position of A.T.C magazine when operating as well as magazine's operation itself. A.T.C Test Bench for BT40 can check A.T.C's basic performance and we can cassure reliability and stability through this tool.
BT40용 A.T.C Test Bench 개발에 관한 연구
김재현(J.H. Kim),이춘만(C.M. Lee),이문재(M.J. Lee),김광선(K.S. Kim),최준영(J.Y. Choi) 한국생산제조학회 2010 한국공작기계학회 추계학술대회논문집 Vol.2010 No.-
This paper is on the development of A.T.C Test Bench for BT40. A Test Bench is consist of hardware part, electronic device part and software part. It is designed to test vibration status and degree of precise position of A.T.C magazine when operating as well as magazine's operation itself. A.T.C Test Bench for BT40 can check A.T.C's basic performance and we can cassure reliability and stability through this tool.
김재현(J.H. Kim),엄준현(J.H. Oum),정영국(Y.G. Jung),임영철(Y.C. Lim) 전력전자학회 2007 전력전자학술대회 논문집 Vol.- No.-
본 연구에서는 Z-소스 네트워크를 갖는 순시전압sag 보상기를 제안하였다. 제안된 시스템은 연료전지 스택(fuel cells stack)을 갖고 있는 Z-소스 인버터의 shoot-through제어에 의하여 ac보상전압을 직접 발생한다. PSIM 시뮬레이션에 의하여 sag와 swell이 발생되는 정상상태와 과도상태에서의 제안된 방법의 타당성을 검토하였다.
띠 굽힘 시험을 통한 100 ㎚ 두께 금 박막의 기계적 특성 평가
김재현(J.H. Kim),이학주(H.J. Lee),한승우(S.W. Han),백창욱(C.-W. Baek),김종만(J.-M. Kim),김용권(Y.-K. Kim) 대한기계학회 2004 대한기계학회 춘추학술대회 Vol.2004 No.4
Nanometer-sized structures are being applied to many devices including micro/nano electronics, optoelectronics, quantum devices, MEMS/NEMS, biosensors, etc. Especially, the thin film with submicron thickness is a basic structure for fabricating these devices, but its mechanical behaviors are not well understood. The mechanical properties of the thin film are different from those of the bulk structure and are difficult to measure because of its handling inconvenience. Several techniques have been applied to mechanical characterization of the thin film, such as nanoindentation test, micro/nano tensile test, strip bending test, etc. In this study, we focus on the strip bending test because of its high accuracy and moderate specimen preparation efforts, and measure Au thin film, which is a very popular material in micro/nano electronic devices. Au film is deposited on Si substrate by evaporation process, of which thickness is 100㎚. Using the strip bending test, we obtain elastic modulus, yield and ultimate tensile strength, and residual stress of Au thin film.