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무연 솔더 접합부을 갖는 플립칩에서의 언더필 및 범프 피치 변화에 의한 열 피로 수명 예측 해석
김성걸,김주영,Kim, Seong-Keol,Kim, Joo-Young 한국생산제조학회 2010 한국생산제조학회지 Vol.26 No.2
This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.
김성걸(Seong Keol Kim) 한국자동차공학회 2005 한국 자동차공학회논문집 Vol.13 No.4
Analyses of dynamic models which were one and two degrees of freedom, and had the nonlinear springs and dampings with certain polynomial functions were performed from SIMULINK in MATLAB. Those consisted of 12 programs and were built on the basis of the preceding programs for the linear dynamic simulations. However the programs for the nonlinear simulations were quite different from those for the linear ones, and showed the results of the analyses in real time with animating. It was found that the programs would help us to solve any kind of nonlinear dynamic simulation with one and two degrees of freedom. Especially, the simulations for 1 DOF system with cubic nonlinear spring force showed the results for Duffing's equation, of which phenomena were jump-up and jump-down. It will be applied to the dynamic simulation of the car seat vibration with a passenger, of which model has the equivalent nonlinear springs and is two degrees of freedom.
김성걸(Kim Seong Keol),문승현(Moon Seung-Hyun),조정인(Cho Jung-In) 한국생산제조학회 2006 한국생산제조시스템학회 학술발표대회 논문집 Vol.2006 No.5
Generally, the integrated system using ion beam consists of 4 major parts, which are SEM, FIB, nano stage, and chamber. FE models are built to perform modal analyses of each part and the whole integrated system with a commercial program. Through these analyses, it is found that each part and the integrated system are very safe against of vibrations including external excitations from ground and any others, because their natural frequencies are much larger than frequencies of external excitations. Also, isolation of ground induced vibration is considered.
플립칩 솔더 접합부의 신뢰성 평가를 위한 보드레벨 낙하해석
김성걸(Kim Seong Keol),김주영(Kim Joo-Young),김상현(Kim Sang-Hyun),양우찬(Yang Uchan),정호동(Jung Ho-Dong),김재호(Kim Jae-Ho) 한국생산제조학회 2008 한국생산제조시스템학회 학술발표대회 논문집 Vol.2008 No.10
Recently, with the trend towards miniaturization and multi-functionality in electronic products such as mobile phone, miniature IC packages such as Flip Chip package have brought new reliability problems. Reliability of IC packages during the drop impact becomes a critical issue. A Flip Chip package with solder bump composition of Sn-1.2Ag-O.7Cu was modeled, and dynamic response of the drop was analyzed by implicit finite element. analysis (FEA) with ANSYS Multiphysics. Also, model analysis was performed. In the results of the drop impact simulation, the stress and strain state in the solder joints were determined. Various peak acceleration shock G-levels and 0.5msec duration time were applied on the basis of JEDEC standard such as JESD22-B111.
플립칩에서 UBM을 고려한 무연 솔더 접합부의 열피로 해석 모사
김성걸(Kim Seong Keol),김주영(Kim Joo-Young),이해웅(Lee Hae-Woong) 한국생산제조학회 2008 한국생산제조시스템학회 학술발표대회 논문집 Vol.2008 No.5
This paper describes in detail the life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package. A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. Two different solder bump pitches were analyzed and the effects of underfill packages were studied. Consequently, this numerical study shows that solder joints with underfill has better fatigue life than solder joints without underfill. Also, 300㎛ pitch solder joints has a longer life than 150㎛ pitch solder joints.
김성걸(Kim Seong Keol),김주영(Kim Joo-Young) 한국생산제조학회 2007 한국생산제조시스템학회 학술발표대회 논문집 Vol.2007 No.5
Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And Lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper describes the life prediction models for SnAgCu and SnPb solder joints, based upon non-linear finite element analysis (FEA). In case of analyses of SnAgCu solder joints, two kinds of shapes are used. As a result, it is found that SnAgCu solder has longer fatigue life than SnPb solder in temperature cycling analyses.
몰드물성 및 Chip의 크기차이에 따른 웨이퍼 레벨 SiP에 대한 열 피로 해석 모사
김성걸(Kim Seong Keol),김주영(Kim Joo-Young),정호동(Jung Hoo-Dong),김재호(Kim Jae Ho) 한국생산제조학회 2009 한국생산제조시스템학회 학술발표대회 논문집 Vol.2009 No.5
This paper describes in detail the life prediction models, and simulation of thermal fatigue under different mold compounds and chip sizes for wafer level embedded SiP. A 3D Finite element model was built to simulate the viscoplastic behaviors for mold compounds and chip sizes. Especially, bonding parts between mold and Silicon Nitride(Si₃N₄) were carefully modelled and distribution of strains was studied. Three different chip sizes were used and the effects of mold compounds were observed. Consequently, this numerical study shows that type-A has better fatigue life than other mold compounds. Also, 4×4 size chip has a shorter life than 6×6 and 8×8 size.
김성걸(Kim Seong Keol) 한국생산제조학회 2007 한국생산제조학회지 Vol.16 No.3
Generally, the integrated system using ion beam consists of 4 major parts, which are SEM, FIB, nano stage, and chamber. Among them, the nano stage and the chamber are designed and manufactured. The whole systems are integrated. Also, FE models are built to perform modal analyses of each part and the whole integrated system with a commercial program. Through these analyses, it is found that each part and the integrated system are very safe against vibrations including external excitations from ground and any others, because their natural frequencies are much larger than frequencies of external excitations. Also, isolation of ground induced vibration is considered.