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김영석(Y.S.Kim),박기철(K.C.Park),김상주(S.J.Kim) 한국자동차공학회 1996 한국자동차공학회 춘 추계 학술대회 논문집 Vol.1996 No.11_1
Boundry element method for 2-dimsional potential problem was used to design of optimum blank shapes for irregular press forming. Material flow at blank holder was asuumed to potential flow. If blank is controlled only by blankhoder, blank shape for optimal drawing was found even though punch profile was complex.<br/> <br/>
안중혁(Joong-Hyok An),김윤재(Yun-Jae Kim),박준협(Jun-Hyub Park),김상주(Sang-Joo Kim),김영진(Young-Jin Kim),이영제(Young-Ze Lee) 한국트라이볼로지학회 2005 한국윤활학회지(윤활학회지) Vol.21 No.2
This paper compares of mechanical tensile properties of 6 kinds of copper foil. The beam lead made with copper foil. Different from other package type such as plastic package, Chip Size Package has a reliability problem in beam lead rather than solder joint in board level. A new tensile loading system was developed using voice-coil actuator. The new tensile loading system has a load cell with maximum capacity of 20 N and a noncontact position measuring system based on the principle of capacitance micrometry with 0.1 ㎚ resolution for displacement measurement. Strain was calculated from the measured displacement using FE analysis. The comparison of mechanical properties helps designer of package to choose copper for ensuring reliability of beam lead in early stage of semiconductor development.