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습식 표면개질 처리된 폴리이미드 필름 표면의 특성에 관한 연구
구석본(S.B. Koo),이홍기(H.K. Lee) 한국표면공학회 2006 한국표면공학회지 Vol.39 No.4
Metallized Polyimide films are extensively used as base materials in microelectronics, optical and automotive applications. However it is difficult to deposit metals on those because of their structural stabilities. In this work, polyimide films are modified by a wet process with alkalinemetalhydroxide and additives to introduce functional groups. The surface molecular structures of polyimide are investigated using X-ray photoelectron spectroscopy(XPS), fourier transform infrared reflection spectroscopy(FTIR-ATR), atomic force microscopic(AFM). XPS spectra and FTIR spectra show that the surface structure of polyimide is converted into potassium polyamate. AFM image and AFM cross-sectional analyses reveal the increased roughness on the modified surface of polyimide films. As a result, it is shown that the adhesion strength between polyimide surface and electroless nickel layer is increased by the nano-anchoring effect.
다공질 전극개발을 위한 알루미늄 분말 복합 전해도금에 대한 연구
이홍기,한성호,구석본 대한금속재료학회 2004 대한금속·재료학회지 Vol.42 No.2
In this study, optimum conditions of aluminium dispersion plating on steel mesh plate for obtaining porous layer has been presented. The process parameters of those conditions have been investigated extensively and the method of making microporous structure of steel electrode has been developed. The optimum process conditions are the particle size : 50-75 μm, the current density : 15 A/dm^(2), pH : 3.5, temperature : 60℃, the agitation rate : 500-600 rpm, the particle concentration : 40-50 g/l, and the distance rate between anode and cathode : 3<P<4.