http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
기계화학적 연마공정중 패드내 미세공극에서의 연마입자의 거동
곽하슬로미(Haslomi Kwark),양우열(Woo-Yul Yang),성인하(In-Ha Sung) 한국트라이볼로지학회 2012 한국윤활학회지(윤활학회지) Vol.28 No.1
In this paper, the results of finite element(FE) analysis of chemical mechanical polishing(CMP) process using 2-dimensional elements were discussed. The objective of this study is to find the generation mechanism of microscratches on a wafer surface during the process. Especially, a FE model with a panicle inside pad pore was considered to observe how such a contact situation could contribute to microscratches generation. The results of the finite element simulations revealed that during CMP process the pad-particle mixture could be formed and this would be a major factor leading to microscratch generation.