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Ellipsometry에서의 Calibration 및 입사면 고정형 Ellipsometer
경재선,오혜근,안일신,김옥경 한국반도체디스플레이기술학회 2003 한국반도체장비학회지 Vol.2 No.4
The general users find difficulties in using ellipsometers. Thus, the object of this study is to construct an ellipsometer with simple operation principle. We developed an ellipsometer which does not require alignment and calibration before measuring sample. A basis structure model after rotating a compensator spectroscopic ellipsometry, the fixed incidence angle at $70^{\circ}$. This ellipsometer does not demand calibration, because the plane of incidence is not changed due to the novel sample holder structure. The results for various standard samples were compared with those from conventional RCSE to test the performance of this instrument. Also repeated measurements were performed to test the precision of the calibration coefficient in a plane of incidence fixed.
Mueller Matrix Ellipsometry 제작 및 응용
방경윤,경재선,오혜근,김옥경,안일신 한국반도체디스플레이기술학회 2004 반도체디스플레이기술학회지 Vol.3 No.1
We develop Mueller-matrix spectroscopic ellipsometry based on dual compensator configuration. This technique is very powerful for measuring surface anisotropy in nano-scale, especially when materials show depolarization. Dual-rotating compensator configuration is adopted with the rotational ratio of 5:3 originally developed by Collins et al[1]. The instrument can provide 250-point spectra over the wavelength range from 230 nm to 820 nm in one irradiance waveform with minimum acquisition time of Tc=10 s. In this work, the results obtained in transmission modes are presented for the initial attempt. We present calibration procedures to diagnose the system from the utilized data collected in transmission mode without sample. We expect that the instrument will have important applications in thin films and surfaces that have anisotropy and inhomogeneity.
Ellipsometry를 이용한 193 nm photoresist에서의 물의 흡수 연구
이형주,이정환,서주빈,경재선,안일신,Lee, Hyoung-Joo,Lee, Jung-Hwan,Seo, Ju-Bin,Kyoung, Jai-Sun,An, Il-Sin 한국반도체디스플레이기술학회 2006 반도체디스플레이기술학회지 Vol.5 No.2
We employed in-situ spectroscopic ellipsometry(SE) and imaging ellipsometry(IE) to study the interaction of water and photoresist(PR) in 193 immersion lithography. Real time measurement of SE showed thickness increase when PR was immerged in water indicating swelling effect. From the temporal evolution we could observe its reaction-limited behavior. Meanwhile, IE could identify the modification of PR surface by contact of water even for a short period of a second.