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정훈(Hoon Jeong),강희석(Huiseok Kang),김완수(Wansu Kim),정상헌(Sangheon Jeong),차동혁(Donghyeok Cha),이덕영(Deokyeong Lee) 한국자동차공학회 2004 한국자동차공학회 춘 추계 학술대회 논문집 Vol.- No.-
Electronic and photonic systems have the trend that is towards ever increasing I/Os on packages, and this in turn is driving the packaging of semiconductors. In this paper, we introduce the bare chip packaging technology which is the chip on board process with high packaging density. And also we describe the core technology to develop bare chip packaging process and show a chip on glass equipment as an example.