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소결된 유리 구체를 다공성 물질로 사용한 마이크로 CPL 설계의 새로운 접근에 관한 연구
허기준(K. J. Hur),권오명(O. M. Kwon),박승호(S. H. Park),정은수(E. S. Jeong),유재륜(J. R. Yoo),강환국(H. K. Kang),이준식(J. S. Lee) 대한기계학회 2005 대한기계학회 춘추학술대회 Vol.2005 No.5
A high performance heat spreader is needed to prevent local heating which is expected to break a chip. A micro CPL is highlighted for a method to improve the existing heat spreader. However, bubble generation between evaporator and liquid line must be kept away to use a micro CPL as a heat spreader. In order to minimize this problem, porous media shall be inserted between evaporator and liquid line. Pore radius of porous media were estimated by capillary pumping limit analysis and porous media were manufactured by inserting micro size glass beads into a jig and sintering at high temperature in a vacuum chamber. It is expected that a micro CPL as a heat spreader is redesigned to minimize bubble generation.
히트파이프 방식의 LED 보안등용 방열장치에 관한 연구
정태성(T.S. Jung),강환국(H.K. Kang) 한국소성가공학회 2011 금형가공 심포지엄 Vol.2011 No.9
With the advantages of power saving, increased life expectancy and fast response time over traditional incandescent bulb, LEDs are increasingly used for many applications including automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, a heat pipe type cooling device, instead of a solid aluminum heat sink, was designed for LED security lightings. And numerical analysis was carried out to evaluate its cooling performance.