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Si 나노 입자와 Er<sup>3+</sup>를 공첨가한 SiO<sub>2</sub>계 도파로의 제작과 평가
최세원,고영호,장세훈,오익현,강창석,Choi, Se-Weon,Ko, Young-Ho,Chang, Se-Hun,Oh, Ik-Hyun,Kang, Chang-Seog 한국재료학회 2007 한국재료학회지 Vol.17 No.4
[ $SiO_2$ ]thin films containing Si-nanocrystals and $Er^{3+}$ were fabricated by the RF-sputtering method. Intense emission of $Er^{3+}$ was observed at 1530 nm region after the annealing of the film at $1050^{circ}C$ for 5 min. Channel waveguides were fabricated using such films for the core. The films containing Si higher than 2.4 at% exhibited the change in stress from compression to tension after annealing, which induced the fatal loss-increase in waveguide. The optical gain might be attained by the Er-doped waveguide with Si lower than 2.4 at% by a visible-light-excitation.
Al-Mg계 합금과 Al-Si계 합금의 다이캐스팅 응고과정의 차이
최세원,김영찬,조재익,강창석,홍성길,Choi, Se-Weon,Kim, Young-Chan,Cho, Jae-Ik,Kang, Chang-Seog,Hong, Sung-Kil 한국재료학회 2012 한국재료학회지 Vol.22 No.2
The effect of the alloy systems Al-Mg alloy and Al-Si alloy in this study on the characteristics of die-casting were investigated using solidification simulation software (MAGMAsoft). Generally, it is well known that the casting characteristics of Al-Mg based alloys, such as the fluidity, feedability and die soldering behaviors, are inferior to those of Al-Si based alloys. However, the simulation results of this study showed that the filling pattern behaviors of both the Al-Mg and Al-Si alloys were found to be very similar, whereas the Al-Mg alloy had higher residual stress and greater distortion as generated due to solidification with a larger amount of volumetric shrinkage compared to the Al-Si alloy. The Al-Mg alloy exhibited very high relative numbers of stress-concentrated regions, especially near the rib areas. Owing to the residual stress and distortion, defects were evident in the Al-Mg alloy in the areas predicted by the simulation. However, there were no visible defects observed in the Al-Si alloy. This suggests that an adequate die temperature and casting process optimization are necessary to control and minimize defects when die casting the Al-Mg alloy. A Tatur test was conducted to observe the shrinkage characteristics of the aluminum alloys. The result showed that hot tearing or hot cracking occurred during the solidification of the Al-Mg alloy due to the large amount of shrinkage.
DRAM 커패시터용 $Ta_2O_5$ 박막의 전기적 특성에 미치는 전극의존성
김영욱,권기원,하정민,강창석,선용빈,김영남,Kim, Yeong-Wook,Gwon, Gi-Won,Ha, Jeong-Min,Kang, Chang-Seog,Seon, Yong-Bin,Kim, Yeong-Nam 한국재료학회 1991 한국재료학회지 Vol.1 No.4
A new electrode material for $Ta_2O_5$ capacitor was developed to obtain both high dielectric constant and improved electrical properties for use in DRAM. High leakage current and low breakdown field of as-deposited $Ta_2O_5$ film on Si is due to the reduction of $Ta_2O_5$ by silicon at $Ta_2O_5$/electrode interface. $Dry-O_2$ anneal improves the electrical properties of $Ta_2O_5$ capacitor with Si electrode, but it thickens the interfacial oxide and lowers the dielectric constant, subsequently. $Ta_2O_5$ capacitor with TiN exectrode shows better electrical properties and higher dielectric constant than post heat treated $Ta_2O_5$ film on Si. No interfacial oxide layer at $Ta_2O_5$/TiN interface suggests that there\`s no Interaction between $Ta_2O_5$ and electrode. TiN is a adequate electrode material for $Ta_2O_5$ capacitor. $Ta_2O_5$ 박막은 실리콘산화막, 실리콘질화막 박막에 비해 유전율은 높으나 누설전류밀도가 높고, 절연파괴강도가 낮아 DRAM의 커패시터용 재료로서 실용화가 되지 못하고 있다. 본 연구에서는 LPCVD법으로 형성시킨 $300{\AA}$ 두께의 $Ta_2O_5$ 유전체박막에 대해 후속열처리 또는 전극재료를 변화시켜 열악한 전기적 특성의 원인을 규명하고자 하였다. 그 결과 다결정 실리콘 전극의 경우 성막상태의 $Ta_2O_5$ 박막은 전극에 의한 환원반응에 의해 전기적 특성이 열화됨을 알 수 있었고, 이를 TiN 전극의 사용으로 억제시킬 수 있었다. 다결정 실리콘 전극의 경우 성막상태의 $Ta_2O_5$ 유전체는 누설정류밀도가 $10^{-1}A/cm^2$, 절연파괴강도가 1.5MV/cm 정도였으며, $800^{\circ}C$에서 $O_2$열처리를 하면 전기적 특성은 개선되나, 유전율이 낮아진다 TiN 전극을 채용할 경우 누설전류밀도 $10^{-6}~10^{-7}A/cm^2$, 절연파괴강도 7~12MV/cm 로 ONO(Oxide-Nitride-Oxide) 박막과 비슷한 $Ta_2O_5$ 고유전막을 얻을 수 있었다.
이종 알루미늄의 ARB공정에 의한 초미세립 복합알루미늄합금판재의 제조 및 평가
이성희 ( Seong Hee Lee ),강창석 ( Chang Seog Kang ) 대한금속재료학회(구 대한금속학회) 2011 대한금속·재료학회지 Vol.49 No.11
Fabrication of a complex aluminum alloy by the ARB process using dissimilar aluminum alloys has been carried out. Two-layer stack ARB was performed for up to six cycles at ambient temperature without a lubricant according to the conventional procedure. Dissimilar aluminum sheets of AA1050 and AA5052 with thickness of 1 mm were degreased and wire-brushed for the ARB process. The sheets were then stacked together and rolled to 50% reduction such that the thickness became 1 mm again. The sheet was then cut into two pieces of identical length and the same procedure was repeated for up to six cycles. A sound complex aluminum alloy sheet was successfully fabricated by the ARB process. The tensile strength increased as the number of ARB cycles was increased, reaching 298 MPa after 5 cycles, which is about 2.2 times that of the initial material. The average grain size was 24㎛after 1 cycle, and became 1.8㎛after 6 cycles.
Al 합금과 STD61강의 소착에 미치는 첨가원소 Fe, Mn의 영향
김유미,홍성길,최세원,김영찬,강창석,Kim, Yu-Mi,Hong, Sung-Kil,Choi, Se-Weon,Kim, Young-Chan,Kang, Chang-Seog 한국재료학회 2012 한국재료학회지 Vol.22 No.4
Recently, various attempts to produce a heat sink made of Al 6xxx alloys have been carried out using die-casting. In order to apply die-casting, the Al alloys should be verified for die-soldering ability with die steel. It is generally well known that both Fe and Mn contents have effects on decreasing die soldering, especially with aluminum alloys containing substantial amounts of Si. However, die soldering has not been widely studied for the low Si aluminum (1.0~2.0wt%) alloys. Therefore, in this study, an investigation was performed to consider how the soldering phenomena were affected by Fe and Mn contents in low Si aluminum alloys. Each aluminum alloy was melted and held at $680^{\circ}C$. Then, STD61 substrate was dipped for 2 hr in the melt. The specimens, which were air cooled, were observed using a scanning electron microscope and were line analyzed by an electron probe micro analyzer. The SEM results of the dipping soldering test showed an Al-Fe inter-metallic layer in the microstructure. With increasing Fe content up to 0.35%, the Al-Fe inter-metallic layer became thicker. In Al-1.0%Si alloy, the additional content of Mn also increased the thickness of the inter-metallic layer compared to that in the alloy without Mn. In addition, EPMA analysis showed that Al-Fe inter-metallic compounds such as $Al_2Fe$, $Al_3Fe$, and $Al_5Fe_2$ formed in the die soldering layers.
Ni기 삽입금속에 의해 진공 브레이징된 STS303-Cu의 특성평가
장세훈,홍지민,최세원,강창석,김호성,오익현,Chang, Se-Hun,Hong, Ji-Min,Choi, Se-Weon,Kang, Chang-Seog,Kim, Ho-Sung,Oh, Ik-Hyun 한국재료학회 2007 한국재료학회지 Vol.17 No.6
Microstructure and tensile strength of the vacuum brazed stainless steel(STS303) and Cu were investigated. For brazing, the BNi-2, 3, 4, 6 and 7 (A.W.S standard) were used as filler metals. The Oxides such as $Cr_2O_3$ and $SiO_2$ were observed at brazed layers between STS303 and Cu matrix. Also, the intermetallic compounds of Cr-B and Ni-P were observed at brazed layers. Brazed STS303-Cu specimens with BNi-2, 3, 4 filler metals showed almost elastic deformation followed by plastic yielding and strain hardening up to a peak stress. On the other hand, it is likely that the fracture of the brazed specimens with BNi-6 and 7 was occurred in elastic range without plastic yielding up to a peak stress. Among these filler metals, the BNi-2 brazed at $1050^{\circ}C$ showed excellent wettability and the highest tensile strength (101.6MPa).
임대영(Dae-Yeong Im),차현록(Hyun-Rok Cha),오익현(Ik-Hyun Oh),강창석(Chang Seog Kang) 한국지능시스템학회 2009 한국지능시스템학회 학술발표 논문집 Vol.19 No.2
본 논문에서는 무선통신을 이용한 밸브제어기의 개발을 제안한다. 솔레노이드밸브제어기를 위해 제어기를 설계하고, ZigBee통신을 이용하여 제어할 수 있도록 하였다. 또한 솔레노이드 밸브제어를 위해 소프트웨어를 제작하였으며 이를 기반으로 실제 하드웨어를 구성하고 제작하여 실험하였다. 실험결과 솔레노이드밸브의 제어가(ON/OFF) 원활이 수행됨을 확인하였다.
알루미늄 금형 소착에 대해 STD61/S45C강과 Si 함량이 미치는 영향
김유미 ( Yu Mi Kim ),최세원 ( Se Weon Choi ),김영찬 ( Young Chan Kim ),강창석 ( Chang Seog Kang ),홍성길 ( Sung Kil Hong ) 대한금속재료학회(구 대한금속학회) 2014 대한금속·재료학회지 Vol.52 No.5
Die soldering is one of common defect generating during the die casting process of aluminum alloys. Until now, the various researchers have been usually studied about die soldering phenomenon in relation to the aluminum components. However, the influence of the mold materials was rarely studied. So, in this study, we have carried out the die-soldering tests using both STD61 and S45C steel to confirm the effect of die materials on die-soldering. Each Aluminum alloys were melted and held at 680℃ and then STD61and S45C steel were dipped for 2hr in the aluminum melt. After dipping, the substrate was cooled in the air and analyzed using a SEM and EPMA. The result of soldering test, reaction layer of STD61 substrate has increased according to Si contents of aluminum, however, reaction layer thickness was deceased in the S45C substrate.
임대영(Dae-Yeong Im),차현록(Hyun Rok Cha),강창석(Chang-Seog Kang) 한국지능시스템학회 2010 한국지능시스템학회 학술발표 논문집 Vol.20 No.1
본 논문은 실내환경감시를 위한 지능형센서의 개발을 제안한다. 개발된 실내환경측정용 지능형센서는 실내의 온도, 습도, 압력을 계측하여 각 가전제품이 동작 할 수 있도록 2.4㎓ 무선통신을 이용하여 가전제품을 동작할 수 있도록 하였다. 또한 센서를 설계하고 하드웨어와 소프트웨어를 개발 하였으며, 실험을 통해 실용성을 입증한 하였다.