초경 시작 시기가 여성 정신분열병 환자의 병의 경과에 미치는 영향

김진훈,윤선욱,배명지,임선진,정은기,장동원 大韓神經精神醫學會 2005 신경정신의학 Vol.44 No.5

Objectives : The protective effects of estrogen against the development of schizophrenia have been investigated in various perspectives, Previous studies showed patients with earlier age of menarche had later onset of schizophrenia and less frequent admissions. This study was performed to evaluate the effect of the age of menarche on subsequent courses including hospitalizations, suicidal attempts, Physical harm to others, and psychotic symptoms in women with schizophrenia. Methods : Self-report menarche age, onset of psychotic symptoms, and clinical status were collected in a sample of 108 Premenopausal women with the diagnosis of schizophrenia. Results : There was significant correlation between the age of menarche and the frequency of admissions (r=.321, p=.006). Also, Patients with history of physical harms to others showed later age of menarche than those without (t=2.025, df=106, p=.045). Conclusion : In women with schizophrenia, the age of onset of menarche affects subsequent courses indicated by frequency of admissions and violent behaviors. It is suggested that identifying the age of menarche might be helpful to predict the courses in women with schizophrenia. Further investigations regarding the relationship between estrogen and the courses of Schizophrenia in women are needed.

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

Yim, Myung-Jin,Kim, Hyoung-Joon,Paik, Kyung-Wook The Korean Microelectronics and Packaging Society 2005 마이크로전자 및 패키징학회지 Vol.12 No.1

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

Review of Electrically Conductive Adhesive Technologies for Electronic Packaging

( Myung Jin Yim ),( Kyung Wook Paik ) 대한금속재료학회 ( 구 대한금속학회 ) 2006 ELECTRONIC MATERIALS LETTERS Vol.2 No.3

Conductive adhesives (ICAs Isotropic Conductive Adhesive, ACAs; An-isotropic Conductive Adhesive & NCAs; Non-conductive Adhesive) offers promising Pb-free process and material solutions for electronic packaging technology to be fine pitch interconnects, low cost and low temperature process and environmentally clean approaches. ICA has been developed and used widely for traditionally solder replacement, especially in surface mount devices and flip chip application. It also need to be lower cost and higher electrical/mechanical and reliability performances. ACAs have been widely used in flat panel display modules to be high resolution, light weight, thin profile and low power consumption in the film forms (Anisotropic Conductive Films; ACFs) for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to for last decades. Multi-layered ACF structures such as double and triple-layered ACFs were developed to meet fine pitch interconnection, low temperature curing and strong adhesion requirements. High mechanical reliability, good electrical performance at high frequency level and effective thermal conductivity for high current density are some of required properties for ACF materials to be pursued for wide usage in flip chip technology. Recently, NCAs are becoming promising for ultra-fine pitch interconnection and low cost joining materials in electronic packaging applications. In this paper, an overview on the recent development and applications of conductive adhesives for electronic packaging with focus on fine pitch capability, electrical/mechanical/thermal performance and wafer level package application are described.

Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Yim, Myung Jin,Jeong, In Ho,Choi, Hyung-Kyu,Hwang, Jin-Sang,Ahn, Jin-Yong,Kwon, Woonseong,Paik, Kyung-Wook IEEE 2005 IEEE transactions on components and packaging tech Vol.28 No.4

Anisotropic conductive adhesives (ACAs) are as promising interconnect materials for flip chip assembly in low cost, high-density, high-speed interconnection packages. We evaluated and compared several flip chip interconnects that use ACAs at the radio frequency (RF) and high-frequency range. The performance of high-speed circuits is limited by the package interconnect discontinuity which is due to large inductance and resistance in the high-frequency range. This discontinuity is determined by the interconnection geometry and materials used. For bumps on the integrated circuit (IC), we used Au studs, Au electroplated and electroless Ni/Au bumps, for the interconnection adhesives, we used two kinds of anisotropic conductive film (ACF) with a different dielectric constant. To evaluate the high frequency model parameters, which we based on an ACF flip chip model and network analysis, we took the high-frequency measurements of test flip chip vehicles that used different bonding materials. Furthermore, to demonstrate real applications for an ACF interconnection at the RF and high-frequency range, we applied ACF flip chip technologies to assemble a passive device that uses an RF integrated passive device. We also applied these technologies to an active device that uses a highly integrated monolithic microwave (IC) device on an RF module. Moreover, we compared the high-frequency characteristics of these devices with those of flip chip assemblies fabricated with conventional methods such as solder ball interconnection.

Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

Yim, Myung Jin,Hwang, Jinsang,Paik, Kyung Wook Butterworth-Heinemann Ltd. 2007 International journal of adhesion & adhesives Vol.27 No.1

<P><B>Abstract</B></P><P>This paper describes the development of anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) application. In order to have reliable COG interconnects using ACF at fine pitch, the number of conductive particles trapped between the bump and substrate pad should be enough and less conductive particle between adjacent bumps. The ACF in this paper has double-layered structure, in which ACF and nonconductive film (NCF) layer thickness is optimized, to have as many conductive particles as possible on bump after COG bonding. In ACF layer, non-conductive particles of diameter 1/5 times smaller than the size of conductive particles were added to prevent electrical short between the bumps of COG assembly. The conductive particles are naturally insulated by the non-conductive particles even though conductive particles are flowed into and agglomerated in narrow gap between bumps during COG bonding. Also, flow property of the conductive particles is restrained due to increased viscosity of ACF layer with non-conductive particles, and the number of the conductive particles is constantly maintained.</P><P>To ensure the insulation property at the level of 10μm gap, insulating coated conductive particles were used in ACF layer composition. The double-layered ACF using low temperature curable binder system was also effective in reducing the warpage level of COG assembly due to low modulus and low bonding temperature.</P>

FLIP CHIP ON ORGANIC BOARD TECHNOLOGY USING MODIFIED ANISOTROPIC CONDUCTIVE FILMS AND ELECTROLESS NICKEL/GOLD BUMP

Yim, Myung-Jin,Jeon, Young-Doo,Paik, Kyung-Wook The Korean Microelectronics and Packaging Society 1999 마이크로전자 및 패키징학회지 Vol.6 No.2

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

Yim, Myung Jin,Paik, Kyung Wook Elsevier 2006 International journal of adhesion and adhesives Vol.26 No.5

<P><B>Abstract</B></P><P>Anisotropic conductive films (ACFs) consist of conducting particles and adhesive polymer resins in a film type and have been widely used for the flat panel display module to be high-resolution, light weight, thin profile and low power consumption in forms of out lead bonding (OLB), flex to printed circuit board bonding (PCB), chip-on-glass (COG) and chip-on-film (COF) in last decades. As the interconnection pitch between driver IC and flex is decreasing, ACF materials have been evolved to meet the fine pitch capability, low-temperature curing and strong adhesion requirements. Multi-layered ACF structures such as double and triple-layered ACFs were developed for the same reason. Flip chip technology has been well-known as one of the solutions to meet today's semiconductor packaging needs of miniaturization of package size as well as reduction in interconnection distance, resulting in high electrical performance. Especially, flip chip assembly using anisotropic conductive adhesives (ACAs) has been gaining much attention for its simple and lead-free processing as well as cost-effective packaging method. High mechanical reliability, good electrical performance at high-frequency range and effective thermal conductivity for high current density are the required properties for the ACF material for wide use in the flip chip application.</P><P>In this paper, an overview on the principles, recent development and applications of ACF materials for flat panel displays and semiconductor packaging applications, with focus on the fine pitch capability, low-temperature bonding process, electrical/mechanical/thermal performance and wafer level package using ACFs are described.</P>

Halorubrum halophilum sp. nov., an extremely halophilic archaeon isolated from a salt-fermented seafood

Yim, Kyung June,Cha, In-Tae,Lee, Hae-Won,Song, Hye Seon,Kim, Kil-Nam,Lee, Sung-Jae,Nam, Young-Do,Hyun, Dong-Wook,Bae, Jin-Woo,Rhee, Sung-Keun,Seo, Myung-Ji,Choi, Jong-Soon,Choi, Hak-Jong,Roh, Seong Wo Springer-Verlag 2014 Antonie van Leeuwenhoek Vol.105 No.3

DEEP-South: Lightcurves of Near Earth Asteroids from Year One Operations

Myung-Jin Kim,Hong-Kyu Moon,Young-Jun Choi,Hong-Suh Yim,Jintae Park,Dong-Goo Roh,Hee-Jae Lee,Young-Seok Oh,Jung-Yong Choi,Young-Ho Bae,DEEP-South Team 한국천문학회 2016 天文學會報 Vol.41 No.2

NSOS-α: THE FIRST KOREAN ASTEROID SURVEY TELESCOPE (지구위협소행성 광학감시시스템)

Myung-Jin Kim,Hong-Suh Yim,Jaemann Kyeong,Youngmin JeongAhn,Hee-Jae Lee,Hong-Kyu Moon,Dong-Goo Roh,Jung Hyun Jo,Jang-Hyun Park,Sungki Cho 한국천문학회 2023 天文學會報 Vol.48 No.2