탄소나노튜브 양에 따른 CMP-PLA 방열 소재의 특성 = Characteristics of CMP-PLA Heatsink Materials with Carbon Nanotube Contents

다국어 초록 (Multilingual Abstract)

In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was $27^{\circ}C$, which increased as time, and it was saturated around $56^{\circ}C$ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.

참고문헌 (Reference)

1 S. Ishida, 113 : 558-, 2009

2 Y. Q. Xu, 112 : 3185-, 2009

3 신부영, "전자선 조사에 의해 상용화된 PLA/PCL 블렌드의 모폴로지 및 유변학적 성질" 한국고분자학회 33 (33): 588-595, 2009