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7 D. Josell, "Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers" 6 (6): C143-, 2009
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1 정민수, "습식표면처리 및 열 사이클에 따른 Cu/SiNx 계면접착에너지 평가 및 분석" 한국마이크로전자및패키징학회 21 (21): 45-50, 2014
2 김명준, "반도체 소자용 구리 배선 형성을 위한 전해 도금" 한국화학공학회 52 (52): 26-39, 2014
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4 A. Barranco, "The chemical state vector: a new concept for the characterization of oxide interfaces" 31 : 761-, 2001
5 P. Kapur, "Technology and reliability constrained future copper interconnects" 49 (49): 590-, 2002
6 R. Reiche, "Structure, microstructure and electronic characterisation of the Al2O3/SiO2 interface by electron spectroscopies" 457 : 199-, 2000
7 D. Josell, "Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers" 6 (6): C143-, 2009
8 W. Sari, "Ru/WNx Bilayers as Diffusion Barriers for Cu Interconnects" 50 : 05-08, 2011
9 B. Li, "Reliability challenges for copper interconnects" 44 : 365-, 2004
10 S. P. Murarka, "Multilevel interconnections for ULSI and GSI era" 19 : 87-, 1997
11 K. V. Sagi, "Investigation of Guanidine Carbonate-Based Slurries for Chemical Mechanical Polishing of Ru/TiN Barrier Films with Minimal Corrosion" 3 (3): 227-, 2014
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18 R. P. Birringer, "Environmentally assisted debonding of copper/barrier interfaces" 60 : 2219-, 2012
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21 M. S. Jeong, "Effects of post-annealing/temperature/humidity treatments on the interfacial reliability of Cu capping layer for advanced Cu interconnects" KMEPS 2013
22 T. E. Hong, "Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology" 580 : 72-, 2013
23 K. M. Latt, "Diffusion barrier properties of ionized metal plasma deposited tantalum nitride thin films between copper and silicon dioxide" 36 : 5845-, 2001
24 H. Kim, "Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing" B21 : 2231-2261, 2003
25 T. Cheon, "Atomic layer deposition of RuAlO thin films as a diffusion barrier for seedless Cu interconnects" 14 (14): D57-, 2011
26 M. S. Chen, "An investigation of the TiOx-SiO2/Mo(112) interface" 574 : 259-, 2005
27 R. H. Dauskardt, "Adhesion and debonding of multi-layer thin film structures" 61 : 141-, 1998
28 P. G. Charalambides, "A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces" 56 (56): 77-, 1989
29 김정규, "4점굽힘시험법을 이용한 함몰전극형 Si 태양전지의 무전해 Ni-P 전극 계면 접착력 평가" 한국마이크로전자및패키징학회 19 (19): 55-60, 2012
30 김재원, "4-point bending test system을 이용한 Cu-Cu 열 압착 접합 특성 평가" 한국마이크로전자및패키징학회 18 (18): 11-18, 2011
31 정명혁, "3차원 적층 패키지를 위한 Cu/thin Sn/Cu 범프구조의 금속간화합물 성장거동분석" 대한금속·재료학회 49 (49): 180-186, 2011