1 Seong-Min Lee, "Thermomechanical Stability of Memory Package with LOC Structure" 대한금속·재료학회 11 (11): 89-93, 2005
2 N. Morita, "The Effect of the Interaction of Abrasive Grains on the Deformation and Fracture Behavior of Brittle Materials" 390-393, 1992
3 S. M. Lee, "The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices" 10-, 2006
4 B. Prince, "Semiconductor Memories" John Wiley & Son 15-, 1991
5 R.R. Tummala, "Microelectronics Packaging Handbook" Van Nostrand Reinhold 10-, 1989
6 S. M. Lee, "In-Situ Examinations of Mechanical Dicing- Induced Damage in Semiconductor Wafer" 2009
7 T. Abe, "A Future Technology for Silicon Wafer Processing for ULSI" 13 (13): 1991
1 Seong-Min Lee, "Thermomechanical Stability of Memory Package with LOC Structure" 대한금속·재료학회 11 (11): 89-93, 2005
2 N. Morita, "The Effect of the Interaction of Abrasive Grains on the Deformation and Fracture Behavior of Brittle Materials" 390-393, 1992
3 S. M. Lee, "The Dependence of Thermal-Cycling-Induced Failure Mechanism on Topological Feature of Passivated Metallic Conductors in Plastic-Encapsulated Microelectronic Devices" 10-, 2006
4 B. Prince, "Semiconductor Memories" John Wiley & Son 15-, 1991
5 R.R. Tummala, "Microelectronics Packaging Handbook" Van Nostrand Reinhold 10-, 1989
6 S. M. Lee, "In-Situ Examinations of Mechanical Dicing- Induced Damage in Semiconductor Wafer" 2009
7 T. Abe, "A Future Technology for Silicon Wafer Processing for ULSI" 13 (13): 1991