1 Tao Lu, "Vibration and Thermal Fatigue Reliability of CCGA Components" 2019 (2019): 1-4, 2019
2 Rajeshuni Ramesham, "Thermal Cycling Testing to Failure of a Ceramic Column Grid Array Package for Space Applications" 2017 (2017): 1-10, 2017
3 Xiaorui Lv, "Reliability Study of the Solder Joints in CCGA Package during Thermal Test" 854-857, 2014
4 ESA, "Manual Soldering of High-Reliability Electrical Connections" European Cooperation for Space Standardization 2009
5 ESA, "High Reliability Soldering for Surface Mount and Mixed Technology" European Cooperation for Space Standardization 2008
6 Mark Fan, "FEA Stress Analysis for the Comparison of BGA and CGA"
7 Zezheng Li, "Effect of Random Vibration Load on Flat Cover and T-shaped Cover in CCGA Package" 2019 (2019): 1-6, 2019
8 Martin Hart, "CCGA Solder Column-Reliable Solution for Absorbing Large CTE Mismatch" 2015 (2015): 1-5, 2015
9 Teng Sue Y., "Brillhart Mark. Reliability Assessment of a High CTE CBGA for High Availability Systems" 52 (52): 611-616, 2002
1 Tao Lu, "Vibration and Thermal Fatigue Reliability of CCGA Components" 2019 (2019): 1-4, 2019
2 Rajeshuni Ramesham, "Thermal Cycling Testing to Failure of a Ceramic Column Grid Array Package for Space Applications" 2017 (2017): 1-10, 2017
3 Xiaorui Lv, "Reliability Study of the Solder Joints in CCGA Package during Thermal Test" 854-857, 2014
4 ESA, "Manual Soldering of High-Reliability Electrical Connections" European Cooperation for Space Standardization 2009
5 ESA, "High Reliability Soldering for Surface Mount and Mixed Technology" European Cooperation for Space Standardization 2008
6 Mark Fan, "FEA Stress Analysis for the Comparison of BGA and CGA"
7 Zezheng Li, "Effect of Random Vibration Load on Flat Cover and T-shaped Cover in CCGA Package" 2019 (2019): 1-6, 2019
8 Martin Hart, "CCGA Solder Column-Reliable Solution for Absorbing Large CTE Mismatch" 2015 (2015): 1-5, 2015
9 Teng Sue Y., "Brillhart Mark. Reliability Assessment of a High CTE CBGA for High Availability Systems" 52 (52): 611-616, 2002