This study aims at looking into the rate effect on the adhesion behavior of silicon punch on to polymer, such as PMMA. The adhesion or the decohesion force between the silicon punch and the substrate strongly depends on the speed at which the punch is...
This study aims at looking into the rate effect on the adhesion behavior of silicon punch on to polymer, such as PMMA. The adhesion or the decohesion force between the silicon punch and the substrate strongly depends on the speed at which the punch is pressed down or pulled off, and this is due to the pull-off speed of the punch whether the silicon is adhered to the polymer substrate after punch is pulled up. A hierarchical multiscale simulation is developed to study the role of the rate effect in the adhesion and decohesion and to capture the atomic origin of the viscous force. To establish a phenomenological constitutive equation on the continuum scale, the molecular dynamics and molecular mechanics simulation is utilized. Then the resulting constitutive equation is implemented into FE code to examine the adhesion and decohesion