1 원종구, "최적 가공 조건을 위한 4인치 웨이퍼의 가공 특성에 관한 연구" 한국생산제조시스템학회 16 (16): 90-95, 2007
2 Liang, H, "Wear phenomena in chemical mechanical polishing" 211 (211): 271-279, 1997
3 Gatzen, H. H, "Wear of single crystal silicon as a function of surface roughness" 254 (254): 907-910, 2003
4 Fu, G, "The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing" 474 (474): 217-221, 2005
5 Mullany, B, "The effect of slurry viscosity on chemical-mechanical polishing of silicon wafers" 132 (132): 28-34, 2003
6 Kim, N. H, "Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions" 83 (83): 362-370, 2006
7 Young, H. T, "Surface integrity of silicon wafers in ultra precision machining" 29 (29): 372-378, 2006
8 Chandra, A, "Prediction of Scratch Generation in Chemical Mechanical Planarization" 58 (58): 559-562, 2008
9 McGrath, J, "Polishing pad surface haracterization in chemical mechanical planarisation" 153 (153): 666-673, 2004
10 Park, B. Y, "Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry" 203 (203): 287-292, 2008
1 원종구, "최적 가공 조건을 위한 4인치 웨이퍼의 가공 특성에 관한 연구" 한국생산제조시스템학회 16 (16): 90-95, 2007
2 Liang, H, "Wear phenomena in chemical mechanical polishing" 211 (211): 271-279, 1997
3 Gatzen, H. H, "Wear of single crystal silicon as a function of surface roughness" 254 (254): 907-910, 2003
4 Fu, G, "The relationship between wafer surface pressure and wafer backside loading in Chemical Mechanical Polishing" 474 (474): 217-221, 2005
5 Mullany, B, "The effect of slurry viscosity on chemical-mechanical polishing of silicon wafers" 132 (132): 28-34, 2003
6 Kim, N. H, "Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions" 83 (83): 362-370, 2006
7 Young, H. T, "Surface integrity of silicon wafers in ultra precision machining" 29 (29): 372-378, 2006
8 Chandra, A, "Prediction of Scratch Generation in Chemical Mechanical Planarization" 58 (58): 559-562, 2008
9 McGrath, J, "Polishing pad surface haracterization in chemical mechanical planarisation" 153 (153): 666-673, 2004
10 Park, B. Y, "Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry" 203 (203): 287-292, 2008
11 Wang, C, "Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization" 54 (54): 309-312, 2005
12 Bastawros, A. F, "Pad Effects on Material Removal Rate in Chemical-Mechanical Planarization" 31 (31): 1022-1031, 2002
13 Chen, C. C. A, "Mechano-chemical polishing of silicon wafers" 140 (140): 373-378, 2003
14 Yuling, L, "Investigation on the final polishing slurry and technique of silicon substrate in ULSI" 66 (66): 438-444, 2003
15 Kwon, D. H, "Heat and its effects to chemical mechanical polishing" 178 (178): 82-87, 2006
16 Kim, H. J, "Friction and thermal phenomena in chemical mechanical polishing" 130 (130): 334-338, 2002
17 Forsberg, M, "Effect of process parameters on material removal rate in chemical mechanical polishing of Si(100)" 77 (77): 319-326, 2005
18 Biswas, R, "Diffusion Limited Agglomeration and Defect Generation during Chemical Mechanical Planarization" 155 (155): D534-D537, 2008
19 Kim, N. H, "Design of experiment(DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing(CMP) process" 83 (83): 506-512, 2006
20 권대희, "CMP특성과 온도의 상호관계에 관한 연구" 한국정밀공학회 19 (19): 156-162, 2002
21 김형재, "CMP 공정에서 발생하는 연마온도 분포에 관한 연구" 한국정밀공학회 20 (20): 223-, 2003
22 Ferreira, S. L. C, "Box- Behnken design: An alternative for the optimization of analytical methods" 597 (597): 179-186, 2007
23 Vishal S Sharma, "Assessment and Optimization of Cutting Parameters while Turning AISI 52100 Steel" 한국정밀공학회 9 (9): 54-62, 2008
24 Kwak, J. S, "Application of Taguchi and response surface methodologies for geometric error in surface grinding process" 45 (45): 327-334, 2005
25 Fu, G, "A Model for Wafer Scale Variation of Material Removal Rate in Chemical Mechanical Polishing Based on Viscoelastic Pad Deformation" 31 (31): 1066-1073, 2002