기판적층 가유전체 전송선로의 효과적 설계 및 파라메트릭 연구

다국어 초록 (Multilingual Abstract)

In this paper, an efficient design and simulation method for exact characteristic impedance of the transmission line with substrate integrated artificial dielectric (SIAD) is described. The optimized square via-hole is adopted instead of circular via structure for the efficient simulation to get the reduced time and computing cost. The simulated characteristic impedance is proved through the practically measured result which is in good agreement with the simulation. The enormous computing time and cost required for the simulation of the transmission line with hundreds of circular via holes are quitely reduced by adopting the square via hole in simulation. Transmission lines with SIAD and various characteristic impedances are designed and fabricated, and the agreement between simulation and measurement is shown. In addition, the parametric study results, which illustrate the characteristic impedance of SIAD transmission lines depends on the via-hole size and pitch, are presented with an excellent agreement.

참고문헌 (Reference)

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