1 이호영, "언더필 기술" 한국표면공학회 36 (36): 1-1, 2003
2 심형섭, "언더필 공정에 대한 유동 특성과 침투 시간예측 연구" 대한용접접합학회 25 (25): 45-50, 2007
3 Xu, C., "Void Risk Prediction for Molded Underfill Technology on Flip Chip Packages" 1345-1350, 2017
4 Washburn, E. W., "The Dynamics of Capillary Flow" 17 (17): 273-283, 1921
5 Ho, P., "Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-Die Flip Chip Ball Grid Array (FCBGA) Package" 640-645, 2007
6 Loh, K., "Preventing Voids in CSP and BGA Underfill Encapsulants" 15 (15): 42-46, 2004
7 Castro, J., "Kinetics and Rheology of Typical Polyurethane Reaction Injection Molding Systems" 26 : 434-438, 1980
8 Fine, P., "Flip Chip Underfill Flow Characteristics and Prediction" 23 (23): 420-427, 2000
9 Khor, C. Y, "Finite Volume Based CFD Simulation of Pressurized Flip-Chip Underfill Encapsulation Process" 50 (50): 98-105, 2010
10 Khor, C., "FVM Based Numerical Study on the Effect of Solder Bump Arrangement on Capillary Driven Flip Chip Underfill Process" 37 (37): 281-286, 2010
1 이호영, "언더필 기술" 한국표면공학회 36 (36): 1-1, 2003
2 심형섭, "언더필 공정에 대한 유동 특성과 침투 시간예측 연구" 대한용접접합학회 25 (25): 45-50, 2007
3 Xu, C., "Void Risk Prediction for Molded Underfill Technology on Flip Chip Packages" 1345-1350, 2017
4 Washburn, E. W., "The Dynamics of Capillary Flow" 17 (17): 273-283, 1921
5 Ho, P., "Study on Factors Affecting Underfill Flow and Underfill Voids in a Large-Die Flip Chip Ball Grid Array (FCBGA) Package" 640-645, 2007
6 Loh, K., "Preventing Voids in CSP and BGA Underfill Encapsulants" 15 (15): 42-46, 2004
7 Castro, J., "Kinetics and Rheology of Typical Polyurethane Reaction Injection Molding Systems" 26 : 434-438, 1980
8 Fine, P., "Flip Chip Underfill Flow Characteristics and Prediction" 23 (23): 420-427, 2000
9 Khor, C. Y, "Finite Volume Based CFD Simulation of Pressurized Flip-Chip Underfill Encapsulation Process" 50 (50): 98-105, 2010
10 Khor, C., "FVM Based Numerical Study on the Effect of Solder Bump Arrangement on Capillary Driven Flip Chip Underfill Process" 37 (37): 281-286, 2010
11 Lee. H. J., "Dynamic Characteristics of Non-Newtonian Underfill in Flip-Chip Packaging" 1862-1867, 2011
12 Young Bae Kim, "Capillary-driven micro flows for the underfill process in microelectronics packaging" 대한기계학회 26 (26): 3751-3759, 2012
13 Wan, J., "An Analytical Model for Predicting the Underfill Flow Characteristics in Flip-Chip Encapsulation" 28 (28): 481-487, 2005