초음파 플립칩 접합 모듈의 위상최적화 설계 및 성능 실험

김지수,김종민,이수일,Kim, Ji Soo,Kim, Jong Min,Lee, Soo Il 대한용접접합학회 2012 대한용접·접합학회지 Vol.30 No.6

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

Kim, Jong-Min,Song, Yong,Cho, Minhaeng,Lee, Seong Hyuk,Shin, Young-Eui The Japan Institute of Metals 2010 Materials transactions Vol.51 No.10

<P>In recent years, Anisotropic Conductive Films (ACFs) have been widely used in microelectronic packaging applications due to their potential advantages, which include low processing temperatures, high-resolution capabilities, and compatibility for nonsolderable materials. In this study, we investigated a novel, thermosonic ACF flip-chip bonding process using ultrasonic vibration. The thermosonic ACF flip-chip bonding was characterized in terms of adhesion strength and electrical property in comparison with conventional thermo-compression ACF bonding. ACF has a nickel particle with a 4-μm diameter, and its recommended thermo-compression bonding conditions were 453 K for bonding temperature and 10 s for bonding time. The investigated thermosonic flip-chip bonding conditions were 433 K and 453 K for bonding temperature and 0.5 s and 1 s for bonding time at each temperature, respectively. In addition, a cross-section of the ACF joint was observed using scanning electron microscopy. As a result, the developed thermosonic flip-chip bonding process showed good electrical and mechanical characteristics, as compared with those of the conventional thermo-compression bonding process. In the future, we expect that a thermosonic flip-chip bonding method with ACFs can be effectively applied to reduce the bonding temperature and time.</P>

플립 칩 접합 장비의 최적 설계에 관한 연구

유재명(Jae-Myung Yoo),송춘삼(Chun-Sam Song),김종형(Jong-Hyeong Kim) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-

Recently, the demand conditions of packaging technology are high performance, multi functionality, high density integration etc.. For these reasons, flip chip assembly is an important technology and interested in researchers. A method of a flip chip assembly has 3 bonding type. One of them is ultrasonic bonding. In this paper, a flip chip bonding equipment using ultrasonic bonding technology which can bond Au-AL is developed. The developed equipment has 3 units - ultrasonic bonding head unit, panel stage unit, align camera unit. Frequency and size of a ultrasonic horn is 40㎑ and 196.5㎜ × 37㎜ × 46.1㎜ respectively. Also size of an IC can use maximum 4㎜ × 25㎜. Stage unit is a precision device of nano-rank for position/velocity and force control. Finally, Camera unit consist of 2 CCD camera module and mirror type for align of COG.

Development of smart transducer with embedded sensor for automatic process control of ultrasonic wire bonding

Or, Siu Wing,Chan, Helen Lai Wa,Liu, Peter Chou Kee Techno-Press 2005 Smart Structures and Systems, An International Jou Vol.1 No.1

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

초음파 신호분석을 이용한 접착접합 이음의 결함평가

황영택,오승규,한준영,장철섭,윤송남,이원,김환태,Hwang, Yeong-Taik,Oh, Seung-Kyu,Han, Jun-Young,Jang, Chul-Sup,Yun, Song-Nam,Yi, Won,Kim, Hwan-Tae 대한용접접합학회 2004 대한용접·접합학회지 Vol.22 No.2

Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of A16061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.

Wire Bonding Head Horn 설계 및 유한요소해석

김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.4

Ultrasonic meching technoloy has been developed over recent years for wire bonding.In this study, ultrasonic welding horn is analysed and designed with FEM, then manufactured based on it. The wire bonding mechine has been designed by conical horn model with very easy to come by and is readily accessible. The analysis is carried out by SoldEdge & Ansys software.

A STUDY OF ADDITIONAL VIBRATION EFFECT ON DENTIN BOND STRENGTH

Lee, Jin,Kim, Jung-Wook,Lee, Sang-Hoon,Kim, Chong-Chul 大韓小兒齒科學會 2002 大韓小兒齒科學會誌 Vol.29 No.4

초음파 진동을 치의학에 처음 이용한 것은 치석 제거기였으나, 최근에는 주조금속과 레진 인레이를 접착할 때, 인산아연시멘트나 레진시멘트의 점도를 낮추는데 이용되고 있다. 이러한 초음파 진동은 재료의 흐름성을 증가시킴으로써 피막도를 낮추고, 따라서 수복물 주위의 미세누출을 감소시킬 수 있는 장점이 있다. 그러나, 복합레진의 수복이 있어서 이러한 초음파 진동의 임상적 효과에 관한 연구가 아직까지 미흡한 실정이다. 이에 저자는 초음파 진동을 상아질 결합제에 적용하여 점도를 감소시킴으로써 상아세관으로의 레진 침투 정도의 변화와 결합력에 미치는 효과를 알아보고자 하였다. 발거 후 실온의 0.1% thymol 용액에 보관된 88 개의 건전한 사람의 대구치를 치관부 법랑질을 제거하고 아크릴 레진을 이용하여 직경 1-inch의 PVC 관에 매몰하였다. 각 시편의 교합면이 아크릴봉과 동일한 높이가 되도록 220-, 500-grit의 연마지로 순차적으로 연마하였고, 무작위로 추출하여 각 군당 22개씩 네 군으로 분류하였다. 1군과 2군은 Single Bond(3M-ESPE, St. Paul, USA)를 3군과 4군은 One-Step(Bisco Inc..Schaumburg, USA)을 제조사의 지시에 따라 치면을 산부식, 수세, 건조한 후 연속하여 2번을 도포하였다. 2군과 4군은 초음파 치석제거기를 이용하여 치면에 대고 10 초간 진동을 가한 후 광중합하였다. 이후 직경 2.3mm, 높이 3.5mm의 Teflon mold(Ultradent Products Inc..South Jordan, USA)를 이용하여 복합레진을 충전한 후 40 초씩 두 번에 나누어 광중합하였다. 모든 시편은 24시간 동안 실온의 수도물에 보관한 후 열순환을 시행하고, 만능측정기(Instron 4465, Canton, USA)로 전단결합강도를 측정하였으며 resin tag의 양상을 비교하기 위해 각 군의 시편의 치질을 탈회시킨 후에 표면을 주사전자현미경으로 관찰하여 다음과 같은 결과를 얻었다. 1. 초음파 진동을 가하지 않은 1군, 3군에 비해 초음파 진동을 가한 2군과 4군에서 전단결합강도가 유의하게 높게 나타났다(p<0.05). 2. Single Bond와 One-Step의 전단결합강도는 유의한 차이를 보이지 않았다(p>0.05). 3. 전자현미경 관찰에서 초음파 진동을 가한 군에서 resin tag의 길이가 길었고, lateral branch의 수도 많이 관찰되었다. The objective of the study was to apply the vibration to reduce the viscosity of bonding adhesives and thereby compare the bond strength and resin penetration into dentinal tubules achieved with those gained using the conventional technique. Eighty-eight noncarious extracted human permanent molar teeth were sectioned to remove the coronal enamel and were embedded in 1-inch PVC pope with acrylic resin. The occlusal surfaces were placed so that the tooth and the embedding medium were at the same level to form one flat surface, and the samples were subsequently polished with silicon carbide abrasive papers. The samples were randomly as-signed to 4 groups(n=22), on group 1 and 2, Single Bond(3M-ESPE, St, Paul, USA) was used, and on Group 3 and 4, One-step(Bisco Inc.. Schaumburg, USA) was used, and each was applied according to its manufacturer´s instructions. For Group 2 and Group 4, vibration was applied with ultrasonic scaler for 10 seconds, and the adhesive was light-cured for 10 seconds. Resin composite was condensed on to the prepared surface in two increments using a mold kit(Ultradent Products Inc..USA) and each was light-cured for 40 seconds. After 24 hours in tap water at room temperature the specimens were thermocycled, and shear bond strengths were measured with a universal testing machine(Instron 4465, Canton, USA). To investigate infiltration patterns of the adhesive materials, the surface of specimen was examined with scanning electron microscope. The results were as follows. 1. The shear bond strengths of vibration group(Group 2, Group 4) were significantly greater than those of the non-vibration group(Group 1, Group 3)(p<0.05). 2. The shear bond strengths of Single Bond and one-Step were not significantly different(p>0.05). 3. The vibration groups showed greater number of resin tags in tubules and lateral branches under SEM.

초음파 신호분석을 이용한 접착접합 이음의 파괴역학적 평가

한준영,오승규,윤송남,이원,장철섭,김민건,김환태,Han, Jun-Young,Oh, Seung-Kyu,Yun, Song-Nam,Lee, Won,Jang, Chul-Sup,Kim, Min-Gun,Kim, Hwan-Tae 대한용접접합학회 2003 대한용접·접합학회지 Vol.21 No.5

In automobile industry, it is necessary to reduce the weight from the view point of energy and environmental problems in these days. One of the ways for weight reduction is using adhesive aluminum structures. In this study, ultrasonic signals reflected from the adhesively bonded joint layer are used to evaluate the adhesively bonded joints. FFT is performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint Al 6061 plates in comparison with the measured and theoretical ratios. And the parameters of ultrasonic wave and the J-integral are investigated to evaluate the adhesively bonded joint strength by DCB specimens.

플립칩 접합용 초음파 혼 모델의 비선형 해석

이수일(Soo Il Lee),홍상혁(Sang Hyuk Hong) 한국생산제조학회 2007 한국공작기계학회 춘계학술대회논문집 Vol.2007 No.-

A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.

최적 혼(Horn) 설계를 위한 진동해석

서정석 한국공작기계학회 2009 한국공작기계학회 춘계학술대회논문집 Vol.2009 No.-

The low temperature bonding have been developed for production techniques of the next generation industries such as Flexible display, OLED(Organic Light-Emitting Diode), Biochip, Flip chip etc. Ultrasonic metal welding using ultrasonic vibrations and pressure is one of the low temperature bonding. It is simple, economical and environmental rather than other welding. Finite element analysis (FEA) using ANSYS was used to study for optimal design in the manufacturing of ultrasonic metal tool : Horn. Design of the Horn is performed by the FEM analysis. These analysis results can be used for optimal design of Horn.