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Preparation and Properties Study of Composites
Yi Xiaoou,Xiong Weihao,Li Jian 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
The particulate strengthened composites were prepared by a PM process to develop novel copper based composites with reasonable strength, high thermal conductivity and low thermal expansion coefficient. Microstructure of the composites was investigated by SEM; the tensile strength, elongation, thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined. A comparative analysis of mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the composites were discussed.