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RISS 인기검색어
- 검색키워드
- 저자 : Tak Gun Jang (검색결과 4 건)
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Exoskeleton-assisted Gait Training in Spinal Disease With Gait Disturbance
Tak Gun Jang,Su Hong Choi,Seung Han Yu,Dong Hwan Kim,In Ho Han,Kyoung Hyup Nam 대한신경손상학회 2022 Korean Journal of Neurotrauma Vol.18 No.2
Objective: Gait impairment reduces a patient’s quality of life. Exoskeletons and wearable robotics enable patients with gait disturbance to stand up and walk. An exoskeleton was developed for use in patients with stroke and spinal cord injuries. This study aimed to evaluate the effectiveness of overground exoskeleton-assisted gait training (OEGT) in spine diseases with gait disturbance. Methods: This was a single-group preliminary study. Five participants with gait disorders because of root dysfunction accompanying spinal stenosis were included in this study. All participants underwent surgical treatment and an exoskeleton training protocol scheduled for 2 or 3 days per week for 4 weeks. Each session was 60 minutes. Clinical tests were performed before (T1) and at the end of the training (T2). Results: One patient dropped out of the study because of medical issues that were not associated with the exoskeleton. Exoskeleton-assisted rehabilitation was feasible for all participants. All participants showed positive changes in gait performance, balance, proximal muscle strength, psychological state, and satisfaction with the rehabilitation. However, there was no significant improvement in neurological deficits. Conclusion: OEGT is a feasible rehabilitation method for patients with gait disorders caused by degenerative spinal disease.
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Contralateral Interhemispheric Transcallosal Approach for Thalamic Cystic Cavernous Malformation
( Tak Gun Jang ),( Seung Heon Cha ),( Won Ho Cho ) 대한뇌종양학회 대한신경종양학회 2021 Brain Tumor Research and Treatment Vol.9 No.2
A 42-year-old man presented with a headache and right hemiparesis and was found to have a cystic mass with a calcified mural nodule in the left thalamus. Because the thalamus is surrounded by vital neurovascular structures, the surgical approach to thalamic lesions can be challenging. We decided to remove the mass for decompression and pathological diagnosis. The mass was removed through a contralateral interhemispheric transcallosal transchoroidal approach with less retraction and parenchymal injury than other approaches to avoid brain retraction and cortical injury. The pathological diagnosis was cavernous malformation. Temporary worsening of the preoperative hemiparesis was recovered over two months following surgery. Tolerable thalamic pain syndrome remained. Here, we report a rare case of thalamic cavernous malformation with a favorable outcome through a contralateral surgical approach.
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충남 서북부지역 여성의 질세포진 검사에 대한 임상적 고찰
이석민,선우재근,장경택,서수형,김민관,배동한 순천향의학연구소 1996 Journal of Soonchunhyang Medical Science Vol.2 No.2
Pap smear were performed to 30,294 women living in the north-west of Chung-nam. The result are summarized below 1. Positive vaginal cytology was 1.09 percent. 2. 72 percents women in their 30's and 40's experienced vaginal cytology. 3. Vaginal cytology was performed at a decreasing rate as age increases. 4. Positive cytology rate is 2.42% higher than average for elderly women over the age of 65. The present date indicates that pap smear is being widely recognized to be important but they needs to be continued advocacy for pap smear.
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고속전단 시험을 이용한 Sn-37Pb BGA solder joints의 기계적 신뢰성 특성 평가
장진규,하상수,하상옥,이종근,문정탁,박재현,서원찬,정승부,Jang, Jin-Kyu,Ha, Sang-Su,Ha, Sang-Ok,Lee, Jong-Gun,Moon, Jung-Tak,Park, Jai-Hyun,Seo, Won-Chan,Jung, Seung-Boo 한국마이크로전자및패키징학회 2008 마이크로전자 및 패키징학회지 Vol.15 No.4
본 연구에서는 BGA(Ball Grid Array) 솔더 접합부에 high impact가 가해졌을 경우 접합부의 기계적 특성에 대해서 연구하였다. 시편은 ENIG(Electroless Nickel Immersion Gold) 표면 처리된 FR-4 기판 위에 직경이 500 ${\mu}m$인 Sn-37Pb 솔더볼을 BGA 방식으로 배열하고 리플로우(Reflow)를 통하여 제작하였다. HTS(High Temperature Storage) 테스트를 위해, 시편을 일정한 온도의 $120^{\circ}C$에서 250시간 동안 시효처리(Aging)를 실시하였다. 시효처리 후, 각각의 시편은 고속 전단 시험기(Dage-4000HS)를 이용하여 속도 변수는 0.01, 0.1, 1, 3 m/s로 설정하여 고속전단 시험을 실시하였다. 전단시험 후, 솔더 접합 계면과 파면을 주사전자현미경(Scanning Electron Microscope, SEM)을 통하여 관찰하였다. 솔더 접합 계면에는 $Ni_3Sn_4$의 금속간 화합물이 성장하였으며, 시효처리 후, 솔더 접합 계면에 생성된 금속간 화합물의 두께가 증가하는 것을 관찰 할 수 있었다. 전단 시험 결과, 전단 속도가 빨라짐에 따라 전단 강도값은 증가하는 경향을 나타내었다. 솔더 접합부의 파단은 전단 속도와 시효처리 시간에 따라 다양한 파괴 모드로 진행됨을 알 수 있었다. 또한, 파괴 모드는 연성파괴 형상을 보이다가 전단속도가 증가함에 따라 취성 파괴 형상으로 변하는 것을 알 수 있었다. The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.
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