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Santosh Kumar,Sabuj Mallik,Ndy Ekere,정재필 대한금속·재료학회 2013 METALS AND MATERIALS International Vol.19 No.5
Stencil printing for flip chip packaging using fine particle solder pastes is a low cost assembly solution with high throughput for fine pitch solder joint interconnects. The manufacturing challenges associated with both solder paste printing increases as electronic device size decreases due to trend of miniaturization in electronic components. Among multiple parameters, the two most important stencil printing parameters are squeegee pressure and printing speed. In this paper, the printing behavior of Pb free Sn-3Ag-0.5Cu solder paste with a particle size distribution of 2-12 μm for wafer level bumping using a stencil printing method (stencil opening dimension -30 μm) was evaluated by varying the printing speed and squeegee pressure to fabricate solder bumps with a sub 100 μm size. The optimal squeegee pressure and print speed for the defect free printing behavior and fairly uniform size distribution of reflowed paste were found to be 7 kgf and 20 mm/s,respectively. The average size of the reflowed printed paste decreased with the increasing squeegee pressure.
Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes
Sharma, Ashutosh,Mallik, Sabuj,Ekere, Nduka N.,Jung, Jae-Pil The Korean Microelectronics and Packaging Society 2014 마이크로전자 및 패키징학회지 Vol.21 No.4
Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.