http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
승온 경화반응속도식을 이용한 LED용 실리콘 렌즈의 유한요소해석
송민재(M. J. Song),홍석관(S. K. Hong),박정연(J. Y. Park),이정원(J. W. Lee),윤길상(G. S. Yoon) 한국소성가공학회 2014 금형가공 심포지엄 Vol.2014 No.8
Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.