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장호남,주대권,김영성,Jang, Ho-Nam,Ju, Dae-Gwon,Kim, Yeong-Seong 대한의용생체공학회 1982 의공학회지 Vol.3 No.2
Glucose oxidase from A. niger was entrapped in polyacrylamide gel which was used in the enzyme electrode for glucose analysis. The electrode was assembled by placing the gel between the membranes on the surface of a Clark type electrode. In order to make it possible to analyze the experimental results later, the stagnation flow was adopted wheree the governing fluid mechanics were well known. The current increased with the increase concentration in the bulk below a certain level of glucose concentration beyond which no more current increase was observed. This is probably due to the diffusion limitation of oxygen from the bulk solution. Also the current increased witll the enzyme loading in the gel, but the linearity between the current and the glucose concentration was rather limited to a narrow range. Flow rate was found to be very important, which means that film diffusion is very important under the flow rate of 5cm/sec. As a conclusion, enzyme loading, gel layer thickness, stirring speed and bulk concentration of glucose were found to be most improtant parameters in yielding a linar current reponse with respect to the bulk glucose concentration.
미세조직이 Sn계 무연솔더의 크리프 특성에 미치는 영향
유진,이규오,주대권,Yoo, Jin,Lee, Kyu-O,Joo, Dae-Kwon 한국마이크로전자및패키징학회 2003 마이크로전자 및 패키징학회지 Vol.10 No.3
SnAg, SnAgCu, SnCu 무연솔더합금을 주조 상태에서 냉간압연한 후 열적으로 안정화한 시편 (TS)과, 실제 솔더 범프와 유사한 미세구조의 수냉에 급속 냉각(WQ)된 시편 두가지를 $100^{\circ}C$에서 크리프 실험을 행하였다. 급속냉각한 시편의 냉각속도는 140-150 K/sec로 primary $\beta-Sn$ 크기가 TS 시편보다 5∼10배 정도 작았으며, 기지내 primary $\beta-Sn$이 차지하는 분율은 증가하였다. 반면에 공정상 내의 $Ag_3Sn$상의 크기는 더 작아졌다. 크리프 실험 결과 WQ 시편의 최소크리프 변형율 속도($\{beta}_{min}$)가 TS 보다 약 $10^2$배 정도 작았으며. 더 큰 파괴시간을 보였다. TS-SnAg의 크리프파괴는 $Ag_3Sn$ 또는 $Cu_6Sn_5$에서의 공공의 핵생성, power-law 크리프에 의한 공공의 성장, 그리고 크리프 공공의 상호 연결로 일어났으며, WQ-SnAgCu는 시편이 두께가 얇아 네킹에 의해 파괴가 일어났다. The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant $\beta-Sn$ globule size was 5∼10 times smaller than that of the TS specimens. Subsequent creep tests showed that the minimum strain rate of TS specimens was about $10_2$ times higher than that of the WQ specimens. Fractographic analyses showed that creep rupture of the TS-SnAgCu specimens occurred by the nucleation of voids on the $Ag_3Sn$ Sn or $Cu_6Sn_5$ particles in the matrix, their subsequent growth by the power-law creep, and inter-linkage of microcracks to form macrocracks which led to the fast failure. On the other hand, no creep voids were found in the WQ specimens due to the mode III shear rupture coming from the thin specimens geometry.