http://chineseinput.net/에서 pinyin(병음)방식으로 중국어를 변환할 수 있습니다.
변환된 중국어를 복사하여 사용하시면 됩니다.
정해도(Haedo Jeong) 한국기계가공학회 2008 한국기계가공학회 춘추계학술대회 논문집 Vol.2008 No.-
The CMP monitoring system was newly developed by the aid of friction force measurement, resulting from installation of piezoelectric quartz sensor on R&D polisher. The correlation between friction and CMP results was investigated in terms of tribological aspects by using the monitoring system. Various friction signals were monitored and analyzed by the change of experimental conditions such as pressure, velocity, pad and slurry. First of all, the lubrication regimes were classified with Sommerfeld Number through measuring coefficient of friction in ILD CMP. And then, the removal mechanism of abrasives could be understood through the correlation with removal rate and coefficient of friction. Especially, the amount of material removal per unit sliding distance is directly proportional to the friction force. The uniformity of CMP performances was also deteriorated as coefficient of friction increased.
정해도(Haedo Jeong) Korean Society for Precision Engineering 2021 한국정밀공학회 학술발표대회 논문집 Vol.2021 No.11월
2020년 대한민국은 수출액에서 세계7위(약 600조원)로, 일본보다 불과 100조원의 차이밖에 나지 않을 만큼 급성장하고 G7의 자리를 노리고 있으며, K-반도체, K-가전 및 K-조선 등 역사상 최고의 경쟁력을 발휘하고 있다. 그러나, 고령화, 가계부채 등에 의해 2050년까지 잠재성장력이 점차 둔화될 것으로 예상된다. 이에 K-Precision은 전통적인 정밀공학에서 차별화된 스마트(Smart)와 녹색(Green)을 비전으로 설정하고 국가경쟁력을 재고하고자 한다. ICAC5 (IoT, Cloud, AI, Car, 5G)의 핵심산업에 대한 DX와 GX의 실현능력에 대해 반도체 기술로 예를 들어 제시하고자 한다. 본 강연에서는 스마트를 위한 디지털화(Digitalization)의 시대적 요구에 대한 K-Precision의 접근법에 대해 소개한다. 사고의 디지털화(Digitalization of Thinking)를 추상(Abstract)과 재구성 (Reconstruction)으로 소개하며, 사물의 디지털화(Digitalization of Things)는 정확(Accuracy)과 정밀(Precision)로 실현하려고 하였다. 개념의 설명을 위해 CMP기술의 개발 및 응용사례를 제시하였다. 본 강의가 젊은 한국정밀공학인의 비전과 역할에 도움이 되기를 기대한다. 밀기계, 수송기계, 바이오 시스템 등 여러 트라이볼로지 응용 기술에 대해서도 논한다. 미래의 트라이볼로지 기술은 최첨단 초정밀공학을 기반으로 제작된 기계부품의 공차를 유지하여 우수한 성능을 영원히 지속 가능케 할 것으로 기대한다.
정해도(Haedo Jeong),박범영(Boumyoung Park),이현섭(Hyunseop Lee),김형재(Hyoungjae Kim),서헌덕(Heondeok Seo) 한국정밀공학회 2004 한국정밀공학회 학술발표대회 논문집 Vol.2004 No.10월
The CMP monitoring system was newly developed by the aid of friction force measurement, resulting from installation of piezoelectric quartz sensor on R&D polisher. The correlation between friction and CMP results was investigated in terms of tribological aspects by using the monitoring system. Various friction signals were monitored and analyzed by the change of experimental conditions such as pressure, velocity, pad and slurry. First of all, the lubrication regimes were classified with Sommerfeld Number through measuring coefficient of friction in ILD CMP. And then, the removal mechanism of abrasives could be understood through the correlation with removal rate and coefficient of friction. Especially, the amount of material removal per unit sliding distance is directly proportional to the friction force. The uniformity of CMP performances was also deteriorated as coefficient of friction increased.
Identification of the Break-In Mechanism by Asperity Deformation of CMP Pad
정경우(Kyeongwoo Jeong),정선호(Seonho Jeong),신소민(Somin Shin),최진욱(Jinuk Choi),정해도(Haedo Jeong) Korean Society for Precision Engineering 2021 한국정밀공학회지 Vol.38 No.2
Chemical Mechanical Planarization (CMP) is an essential process for flattening the surface of the wafer to produce a fine structure. The CMP process is performed after a break-in step prior to optimizing the polishing pad. Break-in consists of the conditioning step and warming-up step. In the conditioning step, a conditioner embedded with diamonds is used to remove residues from the pad surface and manages the directionality and height deviation of asperities on the surface. The warming-up step serves to increase the temperature of the pad surface by polishing multiple wafers. The temperature in the warming-up step is raised due to friction between the wafer and pad, and the pad state is divided into a partly warmed up section, a transition section, and a fully warmed up section of the pad. In this study, as the wafer pressure increased in the warm-up stage, the time for the pad to reach the stable section was confirmed, and the break-in mechanism was analyzed in terms of surface characteristics and mechanical properties, such as surface photograph, surface roughness of the pad, and elastic modulus of pad asperities. Based on these results, the break-in mechanism that increases the material removal rate was analyzed.
화학 기계적 연마에 의한 리튬 니오베이트의 광학 특성에 관한 연구
정석훈(Sukhoon Jeong),김영진(Youngjin Kim),이현섭(hyunseop Lee),정해도(Haedo Jeong) 대한기계학회 2008 대한기계학회 춘추학술대회 Vol.2008 No.5
Lithium niobate (LN:LiNbO₃) is a compound of niobium, lithium and oxygen. The characteristics of LN are piezoelectricity, ferroelectricity and photoelectricity, and which is widely used in widely surface acoustic wave (SAW). To manufacture LN device, the LN surface should be a smooth surface and defect-free because of optical property, but the LN material is processed difficult by traditional processes such as grinding and mechanical polishing (MP) because of its brittleness. To decrease defects, chemical mechanical polishing (CMP) was applied to the LN wafer. In this study, the suitable parameters such as down force and relative velocity, were investigated for the LN CMP process. To improve roughness, the LN CMP was performed using the parameters that were the highest removal rate among process parameters. And, evaluation of optical property was performed by the optical reflectance and non-linear characteristic.
정영석(Youngseok Jeong),김형재(Hyoungjae Kim),정해도(Haedo Jeong) 대한기계학회 2003 대한기계학회 춘추학술대회 Vol.2003 No.4
The friction heat generated by the CMP process hasinfluence on removal rate and WIWNU(Within Wafer Non-Uniformity). Therefore, the object of this study in to find the distribution of temperature on pad surface during CMP process. To do this, the authors analyse the kinematics of CMP equipment to verify the sources of friction heat and compare the analysis result with the experimental results. Through the analysis and experiment conducted in this paper, we can predict the distribution of polishing temperature across the pad surface. Furthermore the result could help to predict the process conditions which could enhance the polishing results, such as WIWNU and removal rate of thin film to achieve more effcient process.