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대면적 레이저 가공을 위한 가감속 파라미터가 가공오차에 미치는 영향
이제훈(Jae Hoon Lee),윤광호(Kwang Ho Yoon),김경한(Kyung Han Kim) Korean Society for Precision Engineering 2014 한국정밀공학회지 Vol.31 No.8
In this paper, it is proposed a method of optimizing path parameters for large-area laser processing. On-the-fly system is necessary for large-area laser processing of uniform quality. It is developed a MOTF(Marking On-The-Fly) board for synchronizing the stage and scanner. And it is introduced the change of the error due to the change of parameters and algorithm for large-area laser processing. This algorithm automatically generates stage path and a velocity profile using acceleration and deceleration parameters. Since this method doesn’t use a G-code, even if without expert knowledge, it has an advantage that can be accessed easily. Angle of one of the square of 350x350mm was changed from 50° to 80° and analyzed the error corresponding to the value of Ta. It is calculated the value of Ta of the best with a precision of 20um through measurement of accuracy according to the Ta of each angle near the edge.
전주금형 제작을 위한 폴리머의 엑시머 레이저 어블레이션
이제훈(Jae Hoon Lee),신동식(Dong Sig Shin),서정(Jeong Suh),김도훈(To Hoon Kim) Korean Society for Precision Engineering 2004 한국정밀공학회지 Vol.21 No.12
Manufacturing process for the micro fluidic device can include such sequential steps as master fabrication, electroforming, and injection molding. The laser ablation using masks has been applied to the fabrication of channels in micro fluidic devices. In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation of PET (polyethylene terephthalate) by the excimer laser radiation could be used successfully to make three dimensional master for nickel mold insert. The mechanism for ablative decomposition of PET with KrF excimer laser (λ: 248 ㎚, pulse duration: 5 ㎱) was explained by photochemical process, while ablation mechanism of PMMA (polymethyl methacrylate) is dominated by photothermal process, the reaction between PC (polycarbonate) and KrF excimer laser beam generate too much surface debris. Thus, PET was adopted in polymer master for nickel mold insert. Nickel electro forming using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in micro structuring.
자궁경부의 인유두종 바이러스 검출에 있어 HPV DNA chip 검사의 임상적 유용성
이제훈 ( Je Hoon Lee ),이기헌 ( Ki Heon Lee ),이인호 ( In Ho Lee ),우혁준 ( Hyuk Jun Woo ),성석주 ( Seok Ju Seong ),김태진 ( Tae Jin Kim ),임경택 ( Kyung Taek Lim ),심재욱 ( Jae Uk Shim ),박종택 ( Chong Taik Park ) 대한산부인과학회 2006 Obstetrics & Gynecology Science Vol.49 No.10
목적: 비정상 자궁경부 세포검사 소견을 보인 환자 중 질확대경 검사나 원추절제술을 통해 조직학적 병변의 유무가 확인된 환자들을 대상으로 HC-II와 HPV DNA chip 검사를 시행하여 각 검사의 임상적 유용성을 확인하고자 한다. 연구 방법: 2004년 7월부터 10월까지 비정상 자궁경부 세포검사 결과로 본원 부인종양센터에서 질확대경하 조직검사 또는 원추절제술을 시행하여 조직학적 소견이 확인된 200명의 환자에서 HPV 감염을 확인하기 위해 HC-II와 HPV DNA chip 검사를 동시에 시행하여 HPV 검출에 두 검사방법의 일치율을 비교하고, HPV DNA chip의 결과로 확인된 HPV 아형들을 분석하였다. 결과: 200명의 대상 환자 중 HC-II와 HPV DNA chip의 결과가 일치한 경우는 171명 (85.5%) 이었다. 비정상 자궁경부세포검사를 보인 환자 중 조직 검사 상 편평콘딜로마 이상의 병변이 확인된 111명의 환자에서, HC-II와 HPV DNA chip 검사의 민감도는 각각 91.0%와 88.3%였다. HPV DNA chip 검사에서 검출된 HPV의 아형들은 HPV-16이 가장 흔하게 검출되었고 (14.7%), 그 다음으로 HPV-58과 HPV-18이 14.1%와 9.8%의 순으로 검출되었다. 결론: 자궁경부의 병변에서 HPV의 검출에 사용되는 HPV DAN chip 검사는 HC-II에 견줄만한 민감도를 갖는 효과적인 방법이다. 또한 HPV DNA chip은 감염된 HPV의 아형을 확인하고 중복감염 등 임상적으로 유용한 정보를 제공하는 장점을 가지고 있다. Objective: This study was performed to investigate the efficacy of HPV DNA chip method for detection and genotyping of various human papillomavirus in the patients with intraepithelial lesions of uterine cervix. Methods: The study subjects included two hundred patients with abnormal Pap smear from July 2004 to October 2004. After confirmed the pathological status of the cervix with colposcopic biopsy or conization, we evaluated for HPV infection and genotyping with the commercially available Hybrid-Capture II assay (HC-II) and HPV DNA chip. Then we compared the concordance rate between the two methods for the detection of HPV and analysed the HPV genotypes. Results: We compared the results in HPV DNA chip with those in HC-II. In result, the concordance rate between the two methods for the detection of HPV was 85.5% (171 of 200 cases). In 111 patients confirmed the presence of lesions higher than flat condyloma in cervix by pathologc examination, sensitivities of HC-II and HPV DNA chip in detecting HPV were 91.0% and 88.3%, respectively. In HPV DNA chip, HPV-16 was the most frequent type (14.7%) in all patients, the next frequent types were HPV-58 (14.1%) and HPV-18 (9.2%). Conclusion: We confirmed that HPV DNA chip method was as sensitive and effective method for detecting HPV in cervical lesions as HC-II. And that it would provide useful clinical information on genotyping and multiple infections of HPV.
이제훈(Jae Hoon Lee),윤광호(Kwang Ho Yoon),김경한(Kyung Han Kim) Korean Society for Precision Engineering 2012 한국정밀공학회지 Vol.29 No.6
Current electronic products are dominated by the laser processing and the application will be extended this time. Especially, demands for high precision laser processing with a large area has been increasing for a number of applications such as in solar cell battery, display parts, electronic component and automobile industry. In this paper we designed an on-the-fly system for ultrafast/high precision/large area laser processing. In addition, we have developed the path algorithm for large area. Expansion of the area in which laser processing is an important factor to handle the ultrafast/wide area processing, it will require a processing path. Processing path is path of 2- axis stage and stage of change in velocity can be smooth as possible. We proposed a path of the user concept using NURBS(Non-Uniform Rational B-Spline)method. Through our experiment with the chopper, was to prove the continuity of edge parts. Through basic shape experiments, we proved that large area can be processed using laser. We developed a simulation tool using Visual C++.
이제훈(Jae Hoon Lee),손현기(Hyonkee Sohn) Korean Society for Precision Engineering 2010 한국정밀공학회지 Vol.27 No.2
Due to the extremely short interaction time (< 10 × 10<SUP>-12</SUP>sec) between laser pulse and material, which enables the minimization of heat affection, ultrafast laser micro-machining has rapidly widened its applications. In this paper, the characteristics of ultrafast laser micro-machining have been reviewed and experimentally demonstrated in laser drilling of silicon wafer and in laser cutting of rigid PCB.