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백수홍(Soo Hong Baek),신동호(Dong Ho Shin),강승환(Seung Hwan Kang),고한서(Han Seo Ko) 대한기계학회 2014 대한기계학회 춘추학술대회 Vol.2014 No.11
A heat sink is the most common cooling device for an electronic apparatus. However, a cross flow fan has been used additionally since it is limited for the heat sink using a natural convection to cool down highly integrated electronic devices like a Central Processing Unit (CPU). The fan has some demerits such as a big volume and a loud noise. Thus, the heat sink with high efficiency using a counter flow by an ion wind was developed in this study after parametric studies were performed by a Computational Fluid Dynamics (CFD) analysis. The optimal design was carried out according to a fin shape and array by comparison study for a fin height and size. Finally, the heat sink with high efficiency for cooling the electronic device was fabricated using the ion wind system.