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문준권,김문일,정재필 대한용접접합학회 2002 대한용접·접합학회지 Vol.20 No.4
Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.
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Si-wafer의 플럭스 리스 플라즈마 무연 솔더링 -플라즈마 클리닝의 영향-
문준권,김정모,정재필 한국마이크로전자및패키징학회 2004 마이크로전자 및 패키징학회지 Vol.11 No.1
플라즈마 리플로우 솔더링에서 솔더볼의 접합성을 향상시키기 위해 UBM(Under Bump Metallization)을 Ar-10vol%$H_2$플라즈마로 클리닝하는 방법을 연구하였다. UBM층은 Si 웨이퍼 위에 Au(두께; 20 nm)/ Cu(4 $\mu\textrm{m}$)/ Ni(4 $\mu\textrm{m}$)/ Al(0.4 $\mu\textrm{m}$)을 웨이퍼 측으로 차례대로 증착하였다. 무연 솔더로는Sn-3.5wt%Ag, Sn-3.5wt%Ag-0.7wt%Cu를 사용하였고 Sn-37wt%Pb를 비교 솔더로 사용하였다. 지름이500 $\mu\textrm{m}$인 솔더 볼을 플라즈마 클리닝 처리를 한 UBM과 처리하지 않은 UBM위에 놓고, Ar-10%$H_2$플라즈마 분위기에서 플럭스 리스 솔더링하였다. 이 결과는 플럭스를 사용하여 대기 중에서 열풍 리플로우한 결과와 비교하였다. 실험 결과, 플라즈마 클리닝 후 플라즈마 리플로우한 솔더의 퍼짐율이 클리닝 하지 않은 플라즈마 솔더링보다 20-40%정도 더 높았다. 플라즈마 클리닝 후 플라즈마 리플로우한 솔더 볼의 전단 강도는 약58-65MPa로, 플라즈마 클리닝 하지 않은 플라즈마 리플로우보다 60-80%정도 높았으며, 플럭스를 사용한 열풍 리플로우보다는 15-35%정도 높았다. 따라서 Ar-10%$H_2$가스를 사용하여 UBM에 플라즈마 클리닝하는 공정은 플라즈마 리플로우 솔더 볼의 접합강도를 향상시키는데 상당한 효과가 있는 것으로 확인되었다. To evaluate the effect of plasma cleaning on the soldering reliability the plasma cleaning using Ar-10vol%$H_2$ gas was applied on a UBM(Under Bump Metallization). The UBM consisted of Au/ Cu/ Ni/ Al layers which were deposited on a Si-wafer with 20 nm/ 4 $\mu\textrm{m}$/ 4 $\mu\textrm{m}$/ 0.4 $\mu\textrm{m}$ thickness respectively. Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-37%Pb solder balls sized of 500 $\mu\textrm{m}$ in diameter were used. Solder balls on the UBM were plasma reflowed under Ar-10%$H_2$ plasma (with or without plasma cleaning). They were compared with air reflowed solder balls with flux. The spreading ratios of plasma reflowed solder with plasma cleaning was 20-40% higher than that of plasma reflowed solder without plasma cleaning. The shear strength of plasma reflowed solder with plasma cleaning was about 58-65MPa. It showed 60-80% higher than that of plasma reflowed solder without plasma cleaning and 15-35% higher than that of air reflowed solder. Thus it was believed that plasma cleaning for the UBM using Ar-10vol%$H_2$ gas was considerably effective for the improvement of the strength of solder ball.
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문준권,강경인,정재필 서울시립대학교정보기술연구소 2002 정보기술연구소 논문집 Vol.4 No.-
Pb is considered to be eliminated from solder, due to its toxicity. Nowadays, in addition to lead free solder, flux is also considered as another harmful substance. Flux is necessary to removal of surface oxide of solders. However, residual flux which remains in the electronic parts after reflow, often cause corrosions of devices[2]. Furthermore, the rinses of flux are also regarded as contaminating substances[3]. So, a lot of interests are concentrated on the development of fluxless soldering process. Until now various fluxless soldering methods are introduced, and plasma treatment is one of them. In this study the influence plasma treatment on the bonded microstructure was investigated, and the plasma was applied for removing the surface oxide of solders. Sn-37Pb, Sn-3.5Ag solder balls are used for this experiments. The commercial automatic soldering machine of hot air blowing type was used for reflow, and solder bump on the Si wafer was formed by Ar+H₂plasma which is generated from plasma etcher. In order to know the influence of plasma treatment on microstructure and mechanical strength, the fracture surfaces of plasma treated one was compared with the non-plasma treated solder bump. Interface strength was measured with shear tester, and SEM was used for view of cross-section and fracture surface of specimens.
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In, Bi를 함유한 Sn-Ag계 무연솔더의 솔더링성 연구
김문일,문준권,정재필 한국마이크로전자및패키징학회 2001 마이크로전자 및 패키징학회지 Vol.8 No.3
Sn-3Ag-8Bi-5In 솔더는 중온계 무연솔더의 하나로서 개발되었다. In함유 솔더는 고가이지만, 솔더의 융점은 Sn-Ag-Cu 합금계보다 낮다. 본 연구에서 사용된 Sn-3Ag-8Bi-5In 솔더의 용융범위는 188~$204^{\circ}C$ 사이이다. 본 연구에서는 Sn-3Ag-8Bi-5In 솔더의 무연솔더로서의 적용가능성을 조사하기 위하여 솔더의 젖음특성을 평가하였다. Sn-3Ag-8Bi-5In 솔더의 젖음성을 기존 솔더 및 다른 무연솔더와 비교하기 위하여 Sn-37Pb, Sn-3.5Ag 공정솔더의 젖음특성도 조사하였다. 실험결과 영점시간과 젖음시간은 Sn-3Ag-8Bi-5In솔더의 경우 $240^{\circ}C$에서 각각 1.1, 2.2 초로서 Sn-37Pb 및 Sn-3.5Ag 무연솔더에 비하여 비슷하거나 다소 우수하였다. 또한, Sn-3Ag-8Bi-5In의 평형젖음력은 $240^{\circ}C$에서 5.8 mN으로 Sn-37Pb 솔더보다 낮고 Sn-3.5Ag 솔더보다 높았다. Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.
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Sn-Ag-X계 무연솔더 접합부의 미세조직 및 전단강도에 관한 연구
김문일,문준권,정재필 대한용접접합학회 2002 대한용접·접합학회지 Vol.20 No.2
Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).
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김문일,문준권,정재필 서울시립대학교정보기술연구소 2001 정보기술연구소 논문집 Vol.3 No.-
Sn-3Ag-8Bi-5In and Sn-X solders of intermediate melting point were investigated for the application of Pb-free solder. Even though In-contained solder is expensive, the melting temperature of this solder is lower than that of the Sn-Ag-Cu alloy. The melting temperature of the Sn-3Ag-8Bi-5In solder on this study is between 188 and 204℃. The results of the wetting test showed that the wetting force and the zero-cross-time of the Sn-3Ag-8Bi-5In solder to Cu-coupon were comparable to Sn-Pb eutectic. The solder ball, which has 0.5mm diameter, was set on the Au/Ni/Cu-pad of FR4-PCB (Printed Circuit Board) and reflowed with Rosin Mildly Activated (RMA)-flux in the air. The reflow temperature was set between 220 and 260℃, and the conveyor speed was between 0.6 and 0.9m/min. Then the shear strength and microstructure of the solder ball were evaluated with or without aging. The solder balls were aged at 110℃ for 860 hours. The shear strength of the Sn-3Ag-8Bi-5In solder ball reflowed at 220∼260℃ was about 410∼540gf as soldered state and it showed same level as Sn-37Pb. The shear strength increased rapidly after aging, about 25% for the first 96 hours of aging. After that, the shear strength became almost constant, with the value of 600gf. Shear strength of Sn-X alloys showed similar values as Sn-37Pb.
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