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      • KCI등재

        광 PCB 및 패키징 기술

        류진화,김동민,김응수,정명영,Ryu, Jin-Hwa,Kim, Dong-Min,Kim, Eung-Soo,Jeong, Myung-Yung 한국마이크로전자및패키징학회 2011 마이크로전자 및 패키징학회지 Vol.18 No.1

        According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

      • KCI우수등재

        전자우편을 이용한 설문조사시 응답률, 응답속도, 자료의 질에 영향을 미치는 요인들에 대한 연구

        류진화(Jin Hwa Ryu),김종훈(Jong Hoon Kim) 한국경영학회 2003 經營學硏究 Vol.32 No.2

        This study investigates what factors affect the response rate, speed, and quality of e-mail survey. It is suggested that the influencing elements include six factors such as personalization, sponsorship, incentives, prenotification. and follow-ups. To verify the validity of six sets of research hypotheses s developed in the study, an experiment with e-mail users was Performed. The 17,480 users identified with e-mail address search-engines were allocated to sixty-four experimental groups through a randomization process. Then, the experimental units of each group were exposed to a unique set of values of independent variables, and their responses to e-mail survey were observed The 652 experimental units responded to the survey, and the response rate turned out to be 3.73%. Data analysis with the ANOVA and Chi-square Test methods showed that five factors except prenotification (personalization, sponsorship, incentives, questionnaire format, and follow-ups) had the impacts on the respondents responses corresponding to the hypotheses, at least to some extent, Yet, with respect to the response speed among the three response dimensions, non of six factors showed any impact corresponding to the hypotheses. Specifically, it was shown that personalization had a positive impact on the response rate and quality as the hypotheses suggest. Using the university sponsorship affected the response rate and quality positively as compared to the use of Private company sponsorship. In contrast, Providing incentives to the test units shoved no significant impact on the response rate and speed. But, some partial evidences for the hypothesis were observed with respect to the impact of incentives un the response quality, questionnaire format seemed to affect the response rate to a significant degree as hypothesized, and it was Partly demonstrated that the factor affected the response quality. In addition, sending follow-ups increased the response rate as hypothesized, but the factor showed no significant impact on the response speed and qualify.

      • SCOPUSKCI등재

        SPL과 소프트 리소그래피를 이용한 나노 구조물 형성 연구

        류진화(Jin Hwa Ryu),정명영(Myung Yung Jeong),김창석(Chang Seok Kim) Korean Society for Precision Engineering 2006 한국정밀공학회지 Vol.23 No.7

        A nanopatterning technique was proposed and demonstrated for low cost and mass productive process using the scanning probe lithography (SPL) and soft lithography. The nanometer scale structure is fabricated by the localized generation of oxide patterning on the H-passivated (100) silicon wafer, and soft lithography was performed to replicate of nanometer scale structures. Both height and width of the silicon oxidation is linear with the applied voltagein SPL, but the growth of width is more sensitive than that of height. The structure below 100 ㎚ was fabricated using HF treatment. To overcome the structure height limitation, aqueous KOH orientation-dependent etching wasperformed on the H-passivated (100) silicon wafer. Soft lithography is also performed for the master replication process. Elastomeric stamp is fabricated by the replica molding technique with ultrasonic vibration. We showed that the elastomeric stamp with the depth of 60 ㎚ and the width of 428 ㎚ was acquired using the original master by SPL process.

      • SCOPUSKCI등재

        임프린트 기반 마이크로 광도파로의 변형 특성 연구

        류진화(Jin Hwa Ryu),김창석(Chang Seok Kim),정명영(Myung Yung Jeong) Korean Society for Precision Engineering 2008 한국정밀공학회지 Vol.25 No.11

        We have studied the characteristic changes of optical device using imprint lithography. An imprinted structure is inherently involved in residual stress due to the temperature and the pressure cycle during fabrication process. A structure with residual stress undergoes stress relaxation, which leads to dimensional change. Therefore, annealing processes was performed to reduce the residual stress of imprinted polymer channel. Reduction of residual stress was confirmed through dimensional change, birefringence, and the mechanical properties. We have fabricated an optical device, and it saw the optical intensity changes within 0.1 % for 1 month.

      • KCI등재

        광 패키징 및 인터커넥션 기술

        김동민,류진화,정명영,Kim, Dong Min,Ryu, Jin Hwa,Jeong, Myung Yung 한국마이크로전자및패키징학회 2012 마이크로전자 및 패키징학회지 Vol.19 No.4

        By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

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