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다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구
류광현(K. H. Ryu),서명희(M. H. Seo),남기중(G. J. Nam),곽노홍(N. H. Kwak) 한국레이저가공학회 2005 한국레이저가공학회지 Vol.8 No.3
A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.
다이오드 레이저를 이용한 Chip On Glass 접합에 관한 연구
서명희(M. H. Seo),류광현(K. H. Ryu),남기중(G. J. Na) 한국정밀공학회 2005 한국정밀공학회 학술발표대회 논문집 Vol.2005 No.10월
A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better for fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/㎝. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.